Brochure
Discover about Henkel's cmprehensive portfolio of advanced materials for various wirebond requirements – from smaller die to pad ratios to thinner bond lines to low stress to high temperature capability and robust adhesion.
From die attach pastes and films, encapsulants, package-level EMI shielding materials, to alternative wafer backside coating (WBC) die attach solutions, Henkel deliver the process adaptability, cost-effectiveness and in-field reliability necessary for today’s advanced wirebond ICs.
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