Skip to Content
Henkel Adhesive Technologies

Henkel Adhesive Technologies


Wirebond packaging material solutions

Discover about Henkel's cmprehensive portfolio of advanced materials for various wirebond requirements – from smaller die to pad ratios to thinner bond lines to low stress to high temperature capability and robust adhesion.

This is the front cover for the white paper

From die attach pastes and films, encapsulants, package-level EMI shielding materials, to alternative wafer backside coating (WBC) die attach solutions, Henkel deliver the process adaptability, cost-effectiveness and in-field reliability necessary for today’s advanced wirebond ICs.

Key insights

Looking for solutions? We can help

Our experts are here to learn more about your needs.

  • A female call-center employee smiling and wearing a headset while working in an office.

    Request a consultation

  • LOCTITE 263 Threadlocker - Application on Bolt

    Request a sample

  • A black female employee scans packages in a warehouse. In the foreground there is the woman with the yellow scanner, in the background scaffolding can be seen.

    Submit an order request

Looking for more support options?

Our support center and experts are ready to help you find solutions for your business needs.