Brochure
Discover about Henkel's cmprehensive portfolio of advanced materials for various wirebond requirements – from smaller die to pad ratios to thinner bond lines to low stress to high temperature capability and robust adhesion.
From die attach pastes and films, encapsulants, package-level EMI shielding materials, to alternative wafer backside coating (WBC) die attach solutions, Henkel deliver the process adaptability, cost-effectiveness and in-field reliability necessary for today’s advanced wirebond ICs.
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Every question, request, and challenge is an opportunity for us to help your business perform. And we have all the right people ready to make it happen.
Check our FAQ for quick answers or reach out via phone to our support center. Here, we also offer additional inquiry forms to help you connect with the appropriate Henkel expert.