Part no. (SKU/IDH):
2167935
IDH Name:
BERGQUIST® GAP PAD® TGP HC3000, 8″x16″ dimension, 0.080″ thickness
Thermal GAP PAD Materials
Soft, fiberglass-reinforced insulation pad for low stress applications
This thermally conductive, silicone-based, fiberglass-reinforced filler has a high thermal conductivity rating of 3.0 W/m-K.
Marketing materials
Part no. (SKU/IDH):
2167935
IDH Name:
BERGQUIST® GAP PAD® TGP HC3000, 8″x16″ dimension, 0.080″ thickness
Thickness Please make your selection 0.080″
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
- Question & answer
BERGQUIST® GAP PAD® TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications requiring low stress on components and boards during assembly.
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Thermal conductivity: 3.0 W/m-K
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High compliance, low compression stress
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Fiberglass-reinforced for shear and tear resistance
- Product category:
- Thermal GAP PAD Materials
Technologies:
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Silicone pads
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Gap pads
- Carrier type:
- Fiberglass
- Color:
- Blue
- Flame rating:
- V-0
- Operating temperature:
- -60.0 °C - 200.0 °C
- Standard thickness:
- 0.508 mm - 3.175 mm
- Thermal conductivity:
- 3.0 W/mK
- Young's modulus, ASTM D575:
- 110.0 KPa (16.0 psi)
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Large volume or special order?
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