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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Thermal GAP PAD Materials

BERGQUIST® GAP PAD® TGP HC3000

Soft, fiberglass-reinforced insulation pad - low stress applications

Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH) 2167935
BERGQUIST® GAP PAD® TGP HC3000, 8″x16″ dimension, 0.080″ thickness

Thickness Please make your selection 0.080″

Documents

Information

BERGQUIST® GAP PAD TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications that require low stress on components and boards during assembly.

Product category:

Thermal GAP PAD Materials

Technologies:

Carrier type:

Fiberglass

Color:

Blue

Flame rating:

V-0

Operating temperature:

-60.0 °C - 200.0 °C

Standard thickness:

0.508 mm - 3.175 mm

Thermal conductivity:

3.0 W/mK

Young's modulus, ASTM D575:

110.0 KPa (16.0 psi)

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