Thermal GAP PAD Materials
Soft, fibreglass reinforced insulation pad - low stress applications
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Technical specification
BERGQUIST® GAP PAD TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications that require low stress on components and boards during assembly.
-60.0 °C - 200.0 °C
0.508 mm - 3.175 mm
Young's modulus, ASTM D575:
110.0 KPa (16.0 psi)