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Material solutions for cloud/ hyperscale data center switches, routers and servers

Find out about our latest solutions for cloud/hyperscale data center switches, routers and servers.

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Consumer demand for high-speed network access, cloud storage, and advanced analytics is driving the need for robust datacenter solutions. Datacenter interconnect (DCI) and 400GE technology are enhancing data switching and routing performance. To meet these demands, Henkel provides cutting-edge adhesives, coatings, and sealants that ensure the reliability and longevity of high-performance computing components in cloud/hyperscale datacenters.

Key insights

Find out about Henkel's diverse TIMs, including pads, films, liquids, and gels, to enhance thermal management and reliability in high-power density line cards and computing servers.
Discover how LOCTITE^® underfills enhance reliability and protect fine-pitch array components in high-performance computing and data processing ASICs.

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LOCTITE^® SI 5421

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Flexible and shielding electrically conductive sealant and adhesive

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Fill encapsulants

LOCTITE^® ECCOBOND EO 1072

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Epoxy dam and fill encapsulant with excellent handling

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Electrically non-conductive adhesives

LOCTITE^® ABLESTIK QMI536NB

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General purpose non-conductive adhesive for stacked die applications

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Electrically conductive adhesives

LOCTITE^® ABLESTIK QMI529HT-LV

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Semi-flexible, electrically conductive adhesive for high temperature applications

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Electrically conductive adhesives

LOCTITE^® ABLESTIK QMI529HT-2A1

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High strength, electrically conductive adhesive for a controlled bondline

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Electrically conductive adhesives

LOCTITE^® ABLESTIK ABP 8068TB

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High performance adhesive with superior thermal and electrical conductivity

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Electrically non-conductive adhesives

LOCTITE^® ABLESTIK 84-3

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General purpose electrically non-conductive die attach adhesive

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Electrically conductive adhesives

LOCTITE^® ABLESTIK 57C

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Specialty electrically conductive adhesive for room temperature cure

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Electrically conductive adhesives

LOCTITE^® ABLESTIK 2030SC

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General purpose electrically conductive adhesive for high-speed dispensing

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Thermally conductive adhesives

LOCTITE^® 315

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Self-shimming, thermally conductive, controlled-strength, activator-cured paste

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Thermally conductive films

BERGQUIST^® microTIM mTIM 1013

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Durable, micro-thermal interface coatings for pluggable optical modules

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Thermal gels

BERGQUIST^® LIQUI FORM TLF LF3500

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For demanding, stay-in-place applications

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