Part no. (SKU/IDH):
2936342
IDH Name:
LOCTITE® ECCOBOND UF 3711, Syringe
Underfills
UV-curable edge bond adhesive for chips
This 1-part, epoxy-based, UV-curable white encapsulant is designed for chips to enhance reliability.
Part no. (SKU/IDH):
2936342
IDH Name:
LOCTITE® ECCOBOND UF 3711, Syringe
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ECCOBOND UF 3711 is a white, thixotropic encapsulant paste for chips to enhance reliability under high temperatures and high humidity. It’s typically used for edge bonding, providing a uniform, void-free layer that optimizes the device's temperature cycling capability and directs stress away from solder connections. It is formulated with an epoxy-based resin and cures with low shrinkage when exposed to UV irradiation or UV and heat.
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Thixotropic for ease of application
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Service/operating temperature: -40°C to 125°C (-40°F to 257°F)
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Very low coefficient of thermal expansion (CTE)
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High glass transition temperature (Tg) and modulus
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UV curable
- Product category:
- Underfills
Technologies:
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Thermosets, electronics assembly materials
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{{#distributor.anyInStock}} In stock {{#distributor.notInStock}} Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly. You will receive an email notification when product is back in stock.You will not receive an email notification when product is back in stock.
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