Underfills
UV-curable edge bond adhesive for chips
This 1-part, epoxy-based, UV-curable white encapsulant is designed for chips to enhance reliability.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ECCOBOND UF 3711 is a white, thixotropic encapsulant paste for chips to enhance reliability under high temperatures and high humidity. It’s typically used for edge bonding, providing a uniform, void-free layer that optimizes the device's temperature cycling capability and directs stress away from solder connections. It is formulated with an epoxy-based resin and cures with low shrinkage when exposed to UV irradiation or UV and heat.
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Thixotropic for ease of application
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Service/operating temperature: -40°C to 125°C (-40°F to 257°F)
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Very low coefficient of thermal expansion (CTE)
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High glass transition temperature (Tg) and modulus
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UV curable
- Product category:
- Underfills
Technologies:
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Thermosets, electronics assembly materials
