Electrically non-conductive adhesives
General purpose non-conductive adhesive for stacked die applications
Semi-flexible hybrid-based electrically non-conductive adhesive. Perfect for insulating die attach applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
For stacked die applications requiring very low stress and robust mechanical properties, LOCTITE® ABLESTIK QMI536NB is ideal. This low bleed, non-electrically conductive PTFE-filled paste has fast cure, high temperature stability and great reliability on a wide variety of surfaces, including solder resist, flexible tape, bare silicon, and various die passivations. A package or device manufactured with this product will have high resistance to delamination and popcorning, even after multiple exposures to lead-free solder reflow temperatures.
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Electrically insulating
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Stacked die application
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Low bleed
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PTFE-filled paste for high temperature stability
Applications:
Die attach
Coefficient of thermal expansion (CTE):
80.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg:
150.0 ppm/°C
Cure type:
Heat cure
Extractable ionic content, Chloride (CI-):
19.0 ppm
Extractable ionic content, Fluoride (F-):
19.0 ppm
Extractable ionic content, Potassium (K+):
19.0 ppm
Extractable ionic content, Sodium (Na+):
19.0 ppm
Glass transition temperature (Tg):
-30.0 °C
Hot die shear strength:
15.0 kg-f
Recommended for use with:
Laminate,Polyimide
Thixotropic index:
5.0
Viscosity:
10000.0 mPa·s (cP)