Henkel Adhesive Technologies

Henkel Adhesive Technologies

Electrically non-conductive adhesives


General purpose, electrically non-conductive adhesive for stacked die applications​

Semi-flexible, hybrid based electrically non-conductive adhesive. Perfect for insulating die attach applications​.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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For stacked die applications requiring very low stress and robust mechanical properties, LOCTITE® ABLESTIK QMI536NB is the answer. This low bleed, non-electrically conductive, PTFE-filled paste has fast cure, high temperature stability and great reliability on a wide variety of surfaces, including solder resist, flexible tape, bare silicon and various die passivations. A package or device manufactured with this product will have high resistance to delamination and popcorning, even after multiple exposures to lead-free solder reflow temperatures.


Die Attach

Coefficient of thermal expansion (CTE):

80.0 ppm/°C

Coefficient of thermal expansion (CTE), Above Tg:

150.0 ppm/°C

Cure type:

Heat Cure

Extractable ionic content, Chloride (CI-):

19.0 ppm

Extractable ionic content, Fluoride (F-):

19.0 ppm

Extractable ionic content, Potassium (K+):

19.0 ppm

Extractable ionic content, Sodium (Na+):

19.0 ppm

Glass transition temperature (Tg):

-30.0 °C

Hot die shear strength:

15.0 kg-f

Recommended for use with:


Thixotropic index:



10000.0 mPa·s (cP)

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