White paper

Look small to go big

In today’s world of unprecedented network and infrastructure expansion, the need for increased performance and stability is accelerating. This rapid expansion is further challenged by the need to process more data at faster speeds while also accommodating emerging technology developments.

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We, Henkel Corporation would like to personalize our digital services, retail activities and online advertising based on an analysis of your interactions with us, our websites and services (as stated under read more), to provide you and the company you are representing, with the most relevant and interesting content.

In particular, we will analyze your use of (1) our newsletter and other e-mail advertisements, (2) our websites, as well as (3) your previous interactions with us, including inquiries and complaints you have issued and purchases you have made for your company, (4) your participation in online and offline events (either hosted by us or a third party), (5) your engagement with our online advertisements on our website as well as third party websites and apps, and (6) the publicly accessible information contained in your professional social media profiles, as well as anonymize any such information in order to enable further analysis of your interactions with us without being able to attribute any such information to you.

I agree to the analysis of my personal data as described above and I want to receive personalized digital content about Henkel Adhesive Technologies, including product offers and other communications:

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Via e-mail

I want to receive the personalized Newsletter and other E-Mail advertisements from you, based on the analysis of my personal data as described above providing me with personalized and up to date information on all products and proposals in the field of Adhesives relevant to me and/or my company.

Via Facebook and LinkedIn

I want advertisements for your products and events regarding adhesives shown to me on Facebook and LinkedIn to be personalized based on the analysis of my personal data as described above. My email address and/or my user ID will be transferred to Meta Platforms Ireland Ltd., 4 Grand Canal Square, Grand Canal Harbour, Dublin 2 Ireland and LinkedIn Corporation, 1000 W. Maude Avenue, Sunnyvale, CA 94085, USA for this purpose.

Via (other) third party websites and apps

I want my experience of product offers, digital content and services of Henkel Corporation and online communication regarding its products and events, also on third party websites and apps, to be personalised based on the analysis of my personal data as described above. My email address and/or my user ID will be transferred to marketing and advertising partners for this purpose.

You may withdraw your consent at any time with effect for the future, for example by managing your communication preferences or deleting your account in the user profile, or by clicking “unsubscribe” or as otherwise described in any of our websites, emails, push notifications or text messaging, as may be applicable to you.

By clicking Get access now, I agree to be bound by the Henkel Terms of Use. I also acknowledge and consent to the practices described in Henkel’s Privacy Policy and CA Privacy rights.

Optimization of a single component, used thousands of times across networks, can add up to big results: increased performance, enhanced speed, and reliability across data centers and optical networks.

By working with datacom and telecom companies, Henkel can help optimize the performance of each and every electronic component, improve overall outcomes, and deliver on the promise of future innovations.

Read this white paper to learn how even the smallest improvements can add up to huge overall improvements in performance, capital expenditure (CapEx), and operating expenditure (OpEx)

Resources

Article
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Case study
Infographic
White paper

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Wi-Fi 6 & 5G: next generation wireless connectivity

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The role of CBRS in private 5G networks

In the US, CBRS was historically reserved for the military and matters relating to public safety. Today, its capabilities enable consumers, enterprises and industrial applications to take advantage of faster 4G LTE and 5G across a much wider area.

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Controlling heat saves money while boosting network speed

Heat is the enemy of circuit boards. Leaps in board density, driven by never-ending demand for bandwidth, make the problem worse. Minimizing the aggregate heat generated by components has a lot of benefits: It improves the integrity of circuit boards, reduces cooling expenses, and lowers repair and maintenance costs. What’s not to like?

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Increased wireless bandwidth requires more attention to heat

Thermal materials help components keep their cool

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Delivering a sustainable 5G future

This article considers key areas where sustainability can be built into the 5G value chain, how major providers are responding, and how the industry can deliver a 5G service with sustainability at its heart.

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What does the future hold for private wireless networks?

This article recaps how 5G private enabled networks deliver value to the digital transformation and IIoT journey, looks at how the private network space is developing, and considers where it could go next.

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Brochures

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Material solutions for AI data center

Find out about Henkel Adhesive Technologies latest solutions for for AI in data centers

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Material solutions for cloud/ hyperscale data center switches, routers and servers

Find out about our latest solutions for cloud/hyperscale data center switches, routers and servers.

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Brochures

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Material solutions for wireless infrastructure 5G telecom solutions

Henkel’s advanced bonding and thermal solutions ensure reliable 5G performance in demanding conditions.

...
Brochures

Upcoming event

Past event

High-performance materials for telecom and datacom

Henkel’s advanced materials guarantee reliable, high-speed data transmission through optimized optical alignment, enhanced light transmittance, and superior heat management.

...

Case study

Upcoming event

Past event

Phase change interface materials for next-gen data center ICs

This case study looks at how low-pressure, low thermal impedance, phase change thermal interface material provides a much-needed solution for next-gen data center ICs.

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Case study

Upcoming event

Past event

Durable TIM coating reduces heat and improves data center switch performance

This case study looks at how durable, thin thermal interface coating reduces heat and improves data center switch performance.

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Upcoming event

Past event

Keep your cool

As network scale, speed, and bandwidth needs skyrocket and component density continues to increase, so does the heat generated within those circuits.

...
Upcoming event

Past event

Network performance and the butterfly effect

As demands for greater bandwidth and faster speeds increase, the stress and strain on networks continues to grow.

...

White Paper

Upcoming event

Past event

The heat is on

Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.

...
White Paper

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The 2023 data center pulse report

With an insatiable demand for faster networking speeds and throughput performance within the data center, 800 Gigabit Ethernet (GbE) is gaining momentum as the next big trend in networking to provide capacity to ever-growing customer demands.

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The 2024 data center pulse report

The influence of innovation and technology on the need to transition from 800G to 1.6T.

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Look small to go big

Get access now

Resources

Wi-Fi 6 & 5G: next generation wireless connectivity

The pandemic has accelerated the need for innovation and business transformation, particularly highlighting the importance of next-generation wireless connectivity technologies like Wi-Fi 6 and 5G in today's enterprises.

The role of CBRS in private 5G networks

In the US, CBRS was historically reserved for the military and matters relating to public safety. Today, its capabilities enable consumers, enterprises and industrial applications to take advantage of faster 4G LTE and 5G across a much wider area.

Controlling heat saves money while boosting network speed

Increased wireless bandwidth requires more attention to heat

Thermal materials help components keep their cool

Delivering a sustainable 5G future

This article considers key areas where sustainability can be built into the 5G value chain, how major providers are responding, and how the industry can deliver a 5G service with sustainability at its heart.

What does the future hold for private wireless networks?

This article recaps how 5G private enabled networks deliver value to the digital transformation and IIoT journey, looks at how the private network space is developing, and considers where it could go next.

Material solutions for AI data center

Find out about Henkel Adhesive Technologies latest solutions for for AI in data centers

Material solutions for cloud/ hyperscale data center switches, routers and servers

Find out about our latest solutions for cloud/hyperscale data center switches, routers and servers.

Material solutions for wireless infrastructure 5G telecom solutions

Henkel’s advanced bonding and thermal solutions ensure reliable 5G performance in demanding conditions.

High-performance materials for telecom and datacom

Henkel’s advanced materials guarantee reliable, high-speed data transmission through optimized optical alignment, enhanced light transmittance, and superior heat management.

Phase change interface materials for next-gen data center ICs

This case study looks at how low-pressure, low thermal impedance, phase change thermal interface material provides a much-needed solution for next-gen data center ICs.

Durable TIM coating reduces heat and improves data center switch performance

This case study looks at how durable, thin thermal interface coating reduces heat and improves data center switch performance.

Keep your cool

As network scale, speed, and bandwidth needs skyrocket and component density continues to increase, so does the heat generated within those circuits.

Network performance and the butterfly effect

As demands for greater bandwidth and faster speeds increase, the stress and strain on networks continues to grow.

The heat is on

Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.

The 2023 data center pulse report

With an insatiable demand for faster networking speeds and throughput performance within the data center, 800 Gigabit Ethernet (GbE) is gaining momentum as the next big trend in networking to provide capacity to ever-growing customer demands.

The 2024 data center pulse report

The influence of innovation and technology on the need to transition from 800G to 1.6T.

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