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Material solutions for AI data center

Find out about Henkel Adhesive Technologies latest solutions for for AI in data centers

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AI's growing demand in data centers drives the integration of high-performance chips like GPUs, FPGAs, and ASICs, which generate significant heat and power densities. Advanced thermal control and interconnect protection are crucial to enhance performance and ensure longevity in these high-power systems.

Key insights

The surge in AI demand in data centers necessitates advanced thermal and interconnect solutions to manage high heat and power densities for optimal performance and durability.
Thermal interface materials (TIMs) are essential for managing heat at the source in data centers, enhancing cooling efficiency and performance.
Henkel’s underfills and encapsulants protect high-density AI ICs from thermo-mechanical stress, ensuring reliability in demanding conditions.

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