White paper

The heat is on

Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.

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This is a front cover image for The Heat is On White Paper

As active cooling measures reach their limit, effective thermal management in hardware components becomes more and more critical to not only maintaining performance but accelerating future innovations.

Selecting the right thermal materials for routers, switches, and circuit boards is essential to reducing heat and realizing the full potential of tomorrow’s 5G, Wi-Fi 6, and 400 GbE data transmission rates.

Read this white paper to learn how even the smallest heat reductions at the component level can add up to huge improvements in cooling, performance, and overall component durability.

Resources

Article
Brochure
Case study
Infographic
White paper

Articles

Upcoming event

Past event

How advanced materials help slow runaway data center costs

Learn how specifying advanced materials in circuit board construction can help stem rising costs in limited IT budgets.

...
Articles

Upcoming event

Past event

Your data center is under water and hotter than ever

Anyone who’s jumped in a cold pool on a hot day understands the effectiveness of liquid cooling. This is certainly not a new concept. Automobile radiators, one of the first examples of liquid cooling in industry, have existed for nearly 125 years.

...
Articles

Upcoming event

Past event

Delivering long-term data center sustainability

In this article, we consider the key priorities for delivering data center sustainability, and the steps being taken to meet them.

...
Articles

Upcoming event

Past event

Does immersion cooling offer a route to the sustainable data center?

This article looks at immersion cooling as one such technology, weighs up its benefits and challenges, and considers whether the drive for data center sustainability will be enough to take it from niche to mainstream adoption.

...
Articles

Upcoming event

Past event

Honeycomb ventilation for the data center

The honeycomb core-to-vent frame attachment is a critical aspect of data center design, and selecting the right adhesive can contribute to achieving the ultimate sweet spot of balancing performance, cost and product lifetime.

...
Articles

Upcoming event

Past event

800G/1.6T optics powering AI revolution

Explore how 800G and 1.6T optics are helping turn AI evolution into revolution by enhancing data center speed and efficiency. Discover how Henkel are driving innovation to meet the growing demands of AI applications.

...

Brochures

Upcoming event

Past event

Material solutions for AI data center

Find out about Henkel Adhesive Technologies latest solutions for for AI in data centers

...
Brochures

Upcoming event

Past event

Material solutions for cloud/ hyperscale data center switches, routers and servers

Find out about our latest solutions for cloud/hyperscale data center switches, routers and servers.

...
Brochures

Upcoming event

Past event

Material solutions for wireless infrastructure 5G telecom solutions

Henkel’s advanced bonding and thermal solutions ensure reliable 5G performance in demanding conditions.

...
Brochures

Upcoming event

Past event

High-performance materials for telecom and datacom

Henkel’s advanced materials guarantee reliable, high-speed data transmission through optimized optical alignment, enhanced light transmittance, and superior heat management.

...

Case study

Upcoming event

Past event

Phase change interface materials for next-gen data center ICs

This case study looks at how low-pressure, low thermal impedance, phase change thermal interface material provides a much-needed solution for next-gen data center ICs.

...
Case study

Upcoming event

Past event

Durable TIM coating reduces heat and improves data center switch performance

This case study looks at how durable, thin thermal interface coating reduces heat and improves data center switch performance.

...

Upcoming event

Past event

Keep your cool

As network scale, speed, and bandwidth needs skyrocket and component density continues to increase, so does the heat generated within those circuits.

...
Upcoming event

Past event

Network performance and the butterfly effect

As demands for greater bandwidth and faster speeds increase, the stress and strain on networks continues to grow.

...

White Paper

Upcoming event

Past event

Look small to go big

In today’s world of unprecedented network and infrastructure expansion, the need for increased performance and stability is accelerating. This rapid expansion is further challenged by the need to process more data at faster speeds while also accommodating emerging technology developments.

...
White Paper

Upcoming event

Past event

The 2023 data center pulse report

With an insatiable demand for faster networking speeds and throughput performance within the data center, 800 Gigabit Ethernet (GbE) is gaining momentum as the next big trend in networking to provide capacity to ever-growing customer demands.

...
White Paper

Upcoming event

Past event

The 2024 data center pulse report

The influence of innovation and technology on the need to transition from 800G to 1.6T.

...

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The heat is on

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Resources

How advanced materials help slow runaway data center costs

Learn how specifying advanced materials in circuit board construction can help stem rising costs in limited IT budgets.

Your data center is under water and hotter than ever

Anyone who’s jumped in a cold pool on a hot day understands the effectiveness of liquid cooling. This is certainly not a new concept. Automobile radiators, one of the first examples of liquid cooling in industry, have existed for nearly 125 years.

Delivering long-term data center sustainability

In this article, we consider the key priorities for delivering data center sustainability, and the steps being taken to meet them.

Does immersion cooling offer a route to the sustainable data center?

This article looks at immersion cooling as one such technology, weighs up its benefits and challenges, and considers whether the drive for data center sustainability will be enough to take it from niche to mainstream adoption.

Honeycomb ventilation for the data center

The honeycomb core-to-vent frame attachment is a critical aspect of data center design, and selecting the right adhesive can contribute to achieving the ultimate sweet spot of balancing performance, cost and product lifetime.

800G/1.6T optics powering AI revolution

Explore how 800G and 1.6T optics are helping turn AI evolution into revolution by enhancing data center speed and efficiency. Discover how Henkel are driving innovation to meet the growing demands of AI applications.

Material solutions for AI data center

Find out about Henkel Adhesive Technologies latest solutions for for AI in data centers

Material solutions for cloud/ hyperscale data center switches, routers and servers

Find out about our latest solutions for cloud/hyperscale data center switches, routers and servers.

Material solutions for wireless infrastructure 5G telecom solutions

Henkel’s advanced bonding and thermal solutions ensure reliable 5G performance in demanding conditions.

High-performance materials for telecom and datacom

Henkel’s advanced materials guarantee reliable, high-speed data transmission through optimized optical alignment, enhanced light transmittance, and superior heat management.

Phase change interface materials for next-gen data center ICs

This case study looks at how low-pressure, low thermal impedance, phase change thermal interface material provides a much-needed solution for next-gen data center ICs.

Durable TIM coating reduces heat and improves data center switch performance

This case study looks at how durable, thin thermal interface coating reduces heat and improves data center switch performance.

Keep your cool

As network scale, speed, and bandwidth needs skyrocket and component density continues to increase, so does the heat generated within those circuits.

Network performance and the butterfly effect

As demands for greater bandwidth and faster speeds increase, the stress and strain on networks continues to grow.

Look small to go big

In today’s world of unprecedented network and infrastructure expansion, the need for increased performance and stability is accelerating. This rapid expansion is further challenged by the need to process more data at faster speeds while also accommodating emerging technology developments.

The 2023 data center pulse report

With an insatiable demand for faster networking speeds and throughput performance within the data center, 800 Gigabit Ethernet (GbE) is gaining momentum as the next big trend in networking to provide capacity to ever-growing customer demands.

The 2024 data center pulse report

The influence of innovation and technology on the need to transition from 800G to 1.6T.

Looking for solutions? We can help

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