White paper

The heat is on

Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.

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This is the frozen computer chip in a block of solid ice

As active cooling measures reach their limit, effective thermal management in hardware components becomes more and more critical to not only maintaining performance but accelerating future innovations.

Selecting the right thermal materials for routers, switches, and circuit boards is essential to reducing heat and realizing the full potential of tomorrow’s 5G, Wi-Fi 6, and 400 GbE data transmission rates.

Read this white paper to learn how even the smallest heat reductions at the component level can add up to huge improvements in cooling, performance, and overall component durability.

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The heat is on

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Resources

Look small to go big

In today’s world of unprecedented network and infrastructure expansion, the need for increased performance and stability is accelerating. This rapid expansion is further challenged by the need to process more data at faster speeds while also accommodating emerging technology developments.

Uniquely Wired

Discover how the best mind in data and telecom are responding to the AI hype and innovating for tomorrow.

The 2024 data center pulse report

The influence of innovation and technology on the need to transition from 800G to 1.6T.

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