Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.
As active cooling measures reach their limit, effective thermal management in hardware components becomes more and more critical to not only maintaining performance but accelerating future innovations.
Selecting the right thermal materials for routers, switches, and circuit boards is essential to reducing heat and realizing the full potential of tomorrow’s 5G, Wi-Fi 6, and 400 GbE data transmission rates.
Read this white paper to learn how even the smallest heat reductions at the component level can add up to huge improvements in cooling, performance, and overall component durability.
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