Case study

Phase change interface materials for next-gen data center ICs

This case study looks at how low-pressure, low thermal impedance, phase change thermal interface material provides a much-needed solution for next-gen data center ICs.

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This is a futuristic concept image of a server in a data center.

Challenge

Data center switches, routers, and servers are incorporating larger, more powerful CPUs/GPUs to manage increasing data processing and bandwidth demands. The new semiconductor packages, many containing multiple large dies, are seeing higher power concentrations, resulting in elevated operational temperatures. At the same time, new generations of switch, router, and server designs are becoming more compact, which limits the thermal material types that are effective with very thin bond lines.

Results

A new silicone-free, phase change TIM has been developed by Henkel that delivers thin bond line capability with low-pressure and low thermal impedance for large die processors and high-power applications.
The material has been tested and validated for a wide power range of up to 800 W.

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Phase change interface materials for next-gen data center ICs

Get access now

Challenge

Results

Resources

Wi-Fi 6 & 5G: next generation wireless connectivity

The pandemic has accelerated the need for innovation and business transformation, particularly highlighting the importance of next-generation wireless connectivity technologies like Wi-Fi 6 and 5G in today's enterprises.

The role of CBRS in private 5G networks

In the US, CBRS was historically reserved for the military and matters relating to public safety. Today, its capabilities enable consumers, enterprises and industrial applications to take advantage of faster 4G LTE and 5G across a much wider area.

Controlling heat saves money while boosting network speed

Increased wireless bandwidth requires more attention to heat

Thermal materials help components keep their cool

Delivering a sustainable 5G future

This article considers key areas where sustainability can be built into the 5G value chain, how major providers are responding, and how the industry can deliver a 5G service with sustainability at its heart.

What does the future hold for private wireless networks?

This article recaps how 5G private enabled networks deliver value to the digital transformation and IIoT journey, looks at how the private network space is developing, and considers where it could go next.

Material solutions for AI data center

Find out about Henkel Adhesive Technologies latest solutions for for AI in data centers

Material solutions for cloud/ hyperscale data center switches, routers and servers

Find out about our latest solutions for cloud/hyperscale data center switches, routers and servers.

Material solutions for wireless infrastructure 5G telecom solutions

Henkel’s advanced bonding and thermal solutions ensure reliable 5G performance in demanding conditions.

High-performance materials for telecom and datacom

Henkel’s advanced materials guarantee reliable, high-speed data transmission through optimized optical alignment, enhanced light transmittance, and superior heat management.

Small cells accelerate mobile broadband access with reliable performance enhanced by thermal control

This case study looks at how small cells accelerate mobile broadband access with reliable performance enhanced by thermal control.

Performance demands for high bandwidth 5G telecom

This case study looks at how ultra-high thermal conductivity, heat-dissipating gel meets processing, performance demands for high bandwidth 5G telecom infrastructure systems.

Durable TIM coating reduces heat and improves data center switch performance

This case study looks at how durable, thin thermal interface coating reduces heat and improves data center switch performance.

Automation-friendly liquid gap filler delivers on thermal control

Learn how a manufacturer of a power converter used thermal management materials to create a more efficient product.

Heat dissipating gel for 5G infrastructure systems

This case study looks at how environmentally-stable, high thermal conductivity, heat-dissipating gel delivers critical cooling for 5G infrastructure systems.

Keep your cool

As network scale, speed, and bandwidth needs skyrocket and component density continues to increase, so does the heat generated within those circuits.

Network performance and the butterfly effect

As demands for greater bandwidth and faster speeds increase, the stress and strain on networks continues to grow.

The heat is on

Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.

Look small to go big

In today’s world of unprecedented network and infrastructure expansion, the need for increased performance and stability is accelerating. This rapid expansion is further challenged by the need to process more data at faster speeds while also accommodating emerging technology developments.

The 2023 data center pulse report

With an insatiable demand for faster networking speeds and throughput performance within the data center, 800 Gigabit Ethernet (GbE) is gaining momentum as the next big trend in networking to provide capacity to ever-growing customer demands.

The 2024 data center pulse report

The influence of innovation and technology on the need to transition from 800G to 1.6T.

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