Case study

Heat dissipating gel for 5G infrastructure systems

This case study looks at how environmentally-stable, high thermal conductivity, heat-dissipating gel delivers critical cooling for 5G infrastructure systems.

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We, Henkel Corporation would like to personalize our digital services, retail activities and online advertising based on an analysis of your interactions with us, our websites and services (as stated under read more), to provide you and the company you are representing, with the most relevant and interesting content.

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This image showcases a thermal gel on a component.

Challenge

In order to manage the 10x increase in cellular data transfer capability, 5G telecom infrastructure systems including remote radio, antenna and base station units have higher-power, more complex electronic designs than their 4G predecessors.

Results

The material’s thermal conductivity and high gap stability provide efficient heat dissipation and high reliability in demanding outdoor environments.
Thermal conductivity of 6.0 W/m-K enables high heat dissipation needed for 5G systems.
Pre-cured liquid gel can accommodate gaps up to 3.0 mm and stays in place once dispensed even in a vertical orientation.

Resources

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The role of CBRS in private 5G networks

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Controlling heat saves money while boosting network speed

Heat is the enemy of circuit boards. Leaps in board density, driven by never-ending demand for bandwidth, make the problem worse. Minimizing the aggregate heat generated by components has a lot of benefits: It improves the integrity of circuit boards, reduces cooling expenses, and lowers repair and maintenance costs. What’s not to like?

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Increased wireless bandwidth requires more attention to heat

Thermal materials help components keep their cool

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Delivering a sustainable 5G future

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This article recaps how 5G private enabled networks deliver value to the digital transformation and IIoT journey, looks at how the private network space is developing, and considers where it could go next.

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Material solutions for wireless infrastructure 5G telecom solutions

Henkel’s advanced bonding and thermal solutions ensure reliable 5G performance in demanding conditions.

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High-performance materials for telecom and datacom

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Phase change interface materials for next-gen data center ICs

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Keep your cool

As network scale, speed, and bandwidth needs skyrocket and component density continues to increase, so does the heat generated within those circuits.

...
Infographic

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Network performance and the butterfly effect

As demands for greater bandwidth and faster speeds increase, the stress and strain on networks continues to grow.

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Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.

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Look small to go big

In today’s world of unprecedented network and infrastructure expansion, the need for increased performance and stability is accelerating. This rapid expansion is further challenged by the need to process more data at faster speeds while also accommodating emerging technology developments.

...
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The 2023 data center pulse report

With an insatiable demand for faster networking speeds and throughput performance within the data center, 800 Gigabit Ethernet (GbE) is gaining momentum as the next big trend in networking to provide capacity to ever-growing customer demands.

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The 2024 data center pulse report

The influence of innovation and technology on the need to transition from 800G to 1.6T.

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Heat dissipating gel for 5G infrastructure systems

Get access now

Challenge

Results

Resources

Wi-Fi 6 & 5G: next generation wireless connectivity

The pandemic has accelerated the need for innovation and business transformation, particularly highlighting the importance of next-generation wireless connectivity technologies like Wi-Fi 6 and 5G in today's enterprises.

The role of CBRS in private 5G networks

In the US, CBRS was historically reserved for the military and matters relating to public safety. Today, its capabilities enable consumers, enterprises and industrial applications to take advantage of faster 4G LTE and 5G across a much wider area.

Controlling heat saves money while boosting network speed

Increased wireless bandwidth requires more attention to heat

Thermal materials help components keep their cool

Delivering a sustainable 5G future

This article considers key areas where sustainability can be built into the 5G value chain, how major providers are responding, and how the industry can deliver a 5G service with sustainability at its heart.

What does the future hold for private wireless networks?

This article recaps how 5G private enabled networks deliver value to the digital transformation and IIoT journey, looks at how the private network space is developing, and considers where it could go next.

Material solutions for AI data center

Find out about Henkel Adhesive Technologies latest solutions for for AI in data centers

Material solutions for cloud/ hyperscale data center switches, routers and servers

Find out about our latest solutions for cloud/hyperscale data center switches, routers and servers.

Material solutions for wireless infrastructure 5G telecom solutions

Henkel’s advanced bonding and thermal solutions ensure reliable 5G performance in demanding conditions.

High-performance materials for telecom and datacom

Henkel’s advanced materials guarantee reliable, high-speed data transmission through optimized optical alignment, enhanced light transmittance, and superior heat management.

Phase change interface materials for next-gen data center ICs

This case study looks at how low-pressure, low thermal impedance, phase change thermal interface material provides a much-needed solution for next-gen data center ICs.

Durable TIM coating reduces heat and improves data center switch performance

This case study looks at how durable, thin thermal interface coating reduces heat and improves data center switch performance.

Keep your cool

As network scale, speed, and bandwidth needs skyrocket and component density continues to increase, so does the heat generated within those circuits.

Network performance and the butterfly effect

As demands for greater bandwidth and faster speeds increase, the stress and strain on networks continues to grow.

The heat is on

Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.

Look small to go big

In today’s world of unprecedented network and infrastructure expansion, the need for increased performance and stability is accelerating. This rapid expansion is further challenged by the need to process more data at faster speeds while also accommodating emerging technology developments.

The 2023 data center pulse report

With an insatiable demand for faster networking speeds and throughput performance within the data center, 800 Gigabit Ethernet (GbE) is gaining momentum as the next big trend in networking to provide capacity to ever-growing customer demands.

The 2024 data center pulse report

The influence of innovation and technology on the need to transition from 800G to 1.6T.

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