Case study

Durable TIM coating reduces heat and improves data center switch performance

This case study looks at how durable, thin thermal interface coating reduces heat and improves data center switch performance.

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This image displays a micro thermal interface coating on a pluggable optical transceiver.

Challenge

Data center ethernet switch manufacturers must tackle the requirement for accelerating data rates and the challenges that presents. At the line card level, one obstacle to maximum performance is the heat generated by higher-wattage pluggable optical modules, also known as POMs or transceivers.

Results

Customer analysis validated Henkel’s internal test data, with Henkel BERGQUIST^® microTIM mTIM 1028 demonstrating average temperature reductions versus a metal-to-metal interface of 3°C at initial, 7.4°C after 100 pulls/insertions and 6.4°C after 250 pulls/insertions. Based on this success, this module plus heat sink combination is now in the field, serving data centers across the globe with improved switch performance.

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Durable TIM coating reduces heat and improves data center switch performance

Get access now

Challenge

Results

Resources

How advanced materials help slow runaway data center costs

Learn how specifying advanced materials in circuit board construction can help stem rising costs in limited IT budgets.

Your data center is under water and hotter than ever

Anyone who’s jumped in a cold pool on a hot day understands the effectiveness of liquid cooling. This is certainly not a new concept. Automobile radiators, one of the first examples of liquid cooling in industry, have existed for nearly 125 years.

Delivering long-term data center sustainability

In this article, we consider the key priorities for delivering data center sustainability, and the steps being taken to meet them.

Does immersion cooling offer a route to the sustainable data center?

This article looks at immersion cooling as one such technology, weighs up its benefits and challenges, and considers whether the drive for data center sustainability will be enough to take it from niche to mainstream adoption.

Honeycomb ventilation for the data center

The honeycomb core-to-vent frame attachment is a critical aspect of data center design, and selecting the right adhesive can contribute to achieving the ultimate sweet spot of balancing performance, cost and product lifetime.

800G/1.6T optics powering AI revolution

Explore how 800G and 1.6T optics are helping turn AI evolution into revolution by enhancing data center speed and efficiency. Discover how Henkel are driving innovation to meet the growing demands of AI applications.

Material solutions for AI data center

Find out about Henkel Adhesive Technologies latest solutions for for AI in data centers

Material solutions for cloud/ hyperscale data center switches, routers and servers

Find out about our latest solutions for cloud/hyperscale data center switches, routers and servers.

Material solutions for wireless infrastructure 5G telecom solutions

Henkel’s advanced bonding and thermal solutions ensure reliable 5G performance in demanding conditions.

High-performance materials for telecom and datacom

Henkel’s advanced materials guarantee reliable, high-speed data transmission through optimized optical alignment, enhanced light transmittance, and superior heat management.

Small cells accelerate mobile broadband access with reliable performance enhanced by thermal control

This case study looks at how small cells accelerate mobile broadband access with reliable performance enhanced by thermal control.

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This case study looks at how ultra-high thermal conductivity, heat-dissipating gel meets processing, performance demands for high bandwidth 5G telecom infrastructure systems.

Automation-friendly liquid gap filler delivers on thermal control

Learn how a manufacturer of a power converter used thermal management materials to create a more efficient product.

Heat dissipating gel for 5G infrastructure systems

This case study looks at how environmentally-stable, high thermal conductivity, heat-dissipating gel delivers critical cooling for 5G infrastructure systems.

Keep your cool

As network scale, speed, and bandwidth needs skyrocket and component density continues to increase, so does the heat generated within those circuits.

Network performance and the butterfly effect

As demands for greater bandwidth and faster speeds increase, the stress and strain on networks continues to grow.

The heat is on

Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.

Look small to go big

In today’s world of unprecedented network and infrastructure expansion, the need for increased performance and stability is accelerating. This rapid expansion is further challenged by the need to process more data at faster speeds while also accommodating emerging technology developments.

Looking for solutions? We can help

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