Case study
This case study looks at how durable, thin thermal interface coating reduces heat and improves data center switch performance.
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Data center ethernet switch manufacturers must tackle the requirement for accelerating data rates and the challenges that presents. At the line card level, one obstacle to maximum performance is the heat generated by higher-wattage pluggable optical modules, also known as POMs or transceivers.
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Customer analysis validated Henkel’s internal test data, with Henkel BERGQUIST® microTIM mTIM 1028 demonstrating average temperature reductions versus a metal-to-metal interface of 3°C at initial, 7.4°C after 100 pulls/insertions and 6.4°C after 250 pulls/insertions. Based on this success, this module plus heat sink combination is now in the field, serving data centers across the globe with improved switch performance.
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