Case study

Automation-friendly liquid gap filler delivers on thermal control

Learn how a manufacturer of a power converter used thermal management materials to create a more efficient product.

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A visual example of thermal management materials on a chip set.

Customer challenge

The customer’s new design for a DC-DC power converter required a more efficient, high-volume solution for the application of thermal management materials.

For previous-generation designs, silicone pads were applied in several locations between the DC-DC converter’s printed circuit board and metal housing. Use of the pads presented several inventory and production-related issues, including:

Operator handling difficulty of the thin sheets
Manual and time-consuming application process
Sourcing of silicone pads in many different sizes and thicknesses

Any new material solution had to provide similar or better thermal performance as that achieved with the silicone pads.

Key results

Reduced overall production costs by 20 to 30%
Achieved 15% volume increase objective
Secured global supply continuity and technical support in all manufacturing regions
Reduced inventory complexity as gap filler can be applied in infinite patterns and thicknesses
Eliminated operator-induced errors and defects

Resources

Article
Brochure
Case study
Infographic
White paper

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Delivering long-term data center sustainability

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Material solutions for AI data center

Find out about Henkel Adhesive Technologies latest solutions for for AI in data centers

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Material solutions for cloud/ hyperscale data center switches, routers and servers

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Material solutions for wireless infrastructure 5G telecom solutions

Henkel’s advanced bonding and thermal solutions ensure reliable 5G performance in demanding conditions.

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Phase change interface materials for next-gen data center ICs

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The heat is on

Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.

...
White paper

Upcoming event

Past event

Look small to go big

In today’s world of unprecedented network and infrastructure expansion, the need for increased performance and stability is accelerating. This rapid expansion is further challenged by the need to process more data at faster speeds while also accommodating emerging technology developments.

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Automation-friendly liquid gap filler delivers on thermal control

Get access now

Customer challenge

Key results

Resources

How advanced materials help slow runaway data center costs

Learn how specifying advanced materials in circuit board construction can help stem rising costs in limited IT budgets.

Your data center is under water and hotter than ever

Anyone who’s jumped in a cold pool on a hot day understands the effectiveness of liquid cooling. This is certainly not a new concept. Automobile radiators, one of the first examples of liquid cooling in industry, have existed for nearly 125 years.

Delivering long-term data center sustainability

In this article, we consider the key priorities for delivering data center sustainability, and the steps being taken to meet them.

Honeycomb ventilation for the data center

The honeycomb core-to-vent frame attachment is a critical aspect of data center design, and selecting the right adhesive can contribute to achieving the ultimate sweet spot of balancing performance, cost and product lifetime.

Material solutions for AI data center

Find out about Henkel Adhesive Technologies latest solutions for for AI in data centers

Material solutions for cloud/ hyperscale data center switches, routers and servers

Find out about our latest solutions for cloud/hyperscale data center switches, routers and servers.

Material solutions for wireless infrastructure 5G telecom solutions

Henkel’s advanced bonding and thermal solutions ensure reliable 5G performance in demanding conditions.

High-performance materials for telecom and datacom

Henkel’s advanced materials guarantee reliable, high-speed data transmission through optimized optical alignment, enhanced light transmittance, and superior heat management.

Phase change interface materials for next-gen data center ICs

This case study looks at how low-pressure, low thermal impedance, phase change thermal interface material provides a much-needed solution for next-gen data center ICs.

Durable TIM coating reduces heat and improves data center switch performance

This case study looks at how durable, thin thermal interface coating reduces heat and improves data center switch performance.

The heat is on

Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.

Look small to go big

In today’s world of unprecedented network and infrastructure expansion, the need for increased performance and stability is accelerating. This rapid expansion is further challenged by the need to process more data at faster speeds while also accommodating emerging technology developments.

Find the right expert

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