Case study

Performance demands for high bandwidth 5G telecom

This case study looks at how ultra-high thermal conductivity, heat-dissipating gel meets processing, performance demands for high bandwidth 5G telecom infrastructure systems.

Get access now

Already have an account?

There is a technical issue, the service is not available and your request is not sent. Please come back later.

Confirm your submission for United States or change your location for proper processing.

Confirm location

Personal details Company details Communication preferences

Step 1 of 3

First name

Last name

Business email

This information will be saved to your account. Go to your account to make changes at any time.

Company name

Size of your organization

Specify the approximate number of employees in your organization within the US.

Market segment

Specify the market segment that best fits the nature of your business.

This information will be saved to your account. Go to your account to make changes at any time.

We, Henkel Corporation would like to personalize our digital services, retail activities and online advertising based on an analysis of your interactions with us, our websites and services (as stated under read more), to provide you and the company you are representing, with the most relevant and interesting content.

In particular, we will analyze your use of (1) our newsletter and other e-mail advertisements, (2) our websites, as well as (3) your previous interactions with us, including inquiries and complaints you have issued and purchases you have made for your company, (4) your participation in online and offline events (either hosted by us or a third party), (5) your engagement with our online advertisements on our website as well as third party websites and apps, and (6) the publicly accessible information contained in your professional social media profiles, as well as anonymize any such information in order to enable further analysis of your interactions with us without being able to attribute any such information to you.

I agree to the analysis of my personal data as described above and I want to receive personalized digital content about Henkel Adhesive Technologies, including product offers and other communications via:

Select all

Via e-mail

I want to receive the personalized Newsletter and other E-Mail advertisements from you, based on the analysis of my personal data as described above providing me with personalized and up to date information on all products and proposals in the field of Adhesives relevant to me and/or my company.

Via Facebook and LinkedIn

I want advertisements for your products and events regarding adhesives shown to me on Facebook and LinkedIn to be personalized based on the analysis of my personal data as described above. My email address and/or my user ID will be transferred to Meta Platforms Ireland Ltd., 4 Grand Canal Square, Grand Canal Harbour, Dublin 2 Ireland and LinkedIn Corporation, 1000 W. Maude Avenue, Sunnyvale, CA 94085, USA for this purpose.

Via (other) third party websites and apps

I want my experience of product offers, digital content and services of Henkel Corporation and online communication regarding its products and events, also on third party websites and apps, to be personalised based on the analysis of my personal data as described above. My email address and/or my user ID will be transferred to marketing and advertising partners for this purpose.

You may withdraw your consent at any time with effect for the future, for example by managing your communication preferences or deleting your account in the user profile, or by clicking “unsubscribe” or as otherwise described in any of our websites, emails, push notifications or text messaging, as may be applicable to you.

By clicking Get access now, I agree to be bound by the Henkel Terms of Use. I also acknowledge and consent to the practices described in Henkel’s Privacy Policy and CA Privacy rights.

This image shows a telecommunication tower in the city.

Challenge

A new 5G massive MIMO active antenna design integrates high-power density components to deliver improved data throughput performance. The advanced ICs within the device generate very high heat. To ensure excellent performance, several thermal, processing, architectural and environmental challenges must be overcome, including: higher operational temperatures versus previous-generation components; smaller, lighter devices with greater thermal loads; deployment in dense urban areas and in elevated, difficult-to-service locations; high-volume production demands.

Results

Henkel has developed a 10.0 W/m-K gel TIM that offers higher thermal conductivity than its predecessor but, remarkably, also has a nearly 30% increased flow rate as demonstrated by a simple cartridge dispense test. Formulating a material of this caliber that provides comprehensive performance and processing capability – high conductivity and excellent/stable dispensability -- is exceptional.
In rheology (dispensability) testing, Henkel’s BERGQUIST^® LIQUI FORM TLF 10000 outperformed other evaluated materials.
BERGQUIST^® LIQUI FORM TLF 10000 gel TIM satisfies the intense heat dissipation requirements of new high bandwidth industrial infrastructure systems, including telecom and datacom applications. The formulation balances high thermal conductivity, low stress, automated dispensability, production consistency and in-application stability.

Resources

Article
Brochure
Case study
Infographic
White paper

Articles

Upcoming event

Past event

Wi-Fi 6 & 5G: next generation wireless connectivity

The pandemic has accelerated the need for innovation and business transformation, particularly highlighting the importance of next-generation wireless connectivity technologies like Wi-Fi 6 and 5G in today's enterprises.

...

5 min.
Articles

Upcoming event

Past event

The role of CBRS in private 5G networks

In the US, CBRS was historically reserved for the military and matters relating to public safety. Today, its capabilities enable consumers, enterprises and industrial applications to take advantage of faster 4G LTE and 5G across a much wider area.

...

5 min.
Articles

Upcoming event

Past event

Controlling heat saves money while boosting network speed

Heat is the enemy of circuit boards. Leaps in board density, driven by never-ending demand for bandwidth, make the problem worse. Minimizing the aggregate heat generated by components has a lot of benefits: It improves the integrity of circuit boards, reduces cooling expenses, and lowers repair and maintenance costs. What’s not to like?

...

5 min.
Articles

Upcoming event

Past event

Increased wireless bandwidth requires more attention to heat

Thermal materials help components keep their cool

...

5 min.
Articles

Upcoming event

Past event

Delivering a sustainable 5G future

This article considers key areas where sustainability can be built into the 5G value chain, how major providers are responding, and how the industry can deliver a 5G service with sustainability at its heart.

...

5 min.
Articles

Upcoming event

Past event

What does the future hold for private wireless networks?

This article recaps how 5G private enabled networks deliver value to the digital transformation and IIoT journey, looks at how the private network space is developing, and considers where it could go next.

...

5 min.

Brochures

Upcoming event

Past event

Material solutions for AI data center

Find out about Henkel Adhesive Technologies latest solutions for for AI in data centers

...
Brochures

Upcoming event

Past event

Material solutions for cloud/ hyperscale data center switches, routers and servers

Find out about our latest solutions for cloud/hyperscale data center switches, routers and servers.

...
Brochures

Upcoming event

Past event

Material solutions for wireless infrastructure 5G telecom solutions

Henkel’s advanced bonding and thermal solutions ensure reliable 5G performance in demanding conditions.

...
Brochures

Upcoming event

Past event

High-performance materials for telecom and datacom

Henkel’s advanced materials guarantee reliable, high-speed data transmission through optimized optical alignment, enhanced light transmittance, and superior heat management.

...

Case study

Upcoming event

Past event

Small cells accelerate mobile broadband access with reliable performance enhanced by thermal control

This case study looks at how small cells accelerate mobile broadband access with reliable performance enhanced by thermal control.

...

10 min.
Case study

Upcoming event

Past event

Automation-friendly liquid gap filler delivers on thermal control

Learn how a manufacturer of a power converter used thermal management materials to create a more efficient product.

...

5 min.
Case study

Upcoming event

Past event

Heat dissipating gel for 5G infrastructure systems

This case study looks at how environmentally-stable, high thermal conductivity, heat-dissipating gel delivers critical cooling for 5G infrastructure systems.

...

10 min.

Infographic

Upcoming event

Past event

Keep your cool

As network scale, speed, and bandwidth needs skyrocket and component density continues to increase, so does the heat generated within those circuits.

...
Infographic

Upcoming event

Past event

Network performance and the butterfly effect

As demands for greater bandwidth and faster speeds increase, the stress and strain on networks continues to grow.

...

Upcoming event

Past event

The heat is on

Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.

...
White paper

Upcoming event

Past event

Look small to go big

In today’s world of unprecedented network and infrastructure expansion, the need for increased performance and stability is accelerating. This rapid expansion is further challenged by the need to process more data at faster speeds while also accommodating emerging technology developments.

...

Looking for solutions? We can help

Our experts are here to learn more about your needs.

Request a consultation
Request a sample
Submit an order request

Looking for more support options?

Our support center and experts are ready to help you find solutions for your business needs.

Visit support center

Performance demands for high bandwidth 5G telecom

Get access now

Challenge

Results

Resources

Wi-Fi 6 & 5G: next generation wireless connectivity

The pandemic has accelerated the need for innovation and business transformation, particularly highlighting the importance of next-generation wireless connectivity technologies like Wi-Fi 6 and 5G in today's enterprises.

The role of CBRS in private 5G networks

In the US, CBRS was historically reserved for the military and matters relating to public safety. Today, its capabilities enable consumers, enterprises and industrial applications to take advantage of faster 4G LTE and 5G across a much wider area.

Controlling heat saves money while boosting network speed

Increased wireless bandwidth requires more attention to heat

Thermal materials help components keep their cool

Delivering a sustainable 5G future

This article considers key areas where sustainability can be built into the 5G value chain, how major providers are responding, and how the industry can deliver a 5G service with sustainability at its heart.

What does the future hold for private wireless networks?

This article recaps how 5G private enabled networks deliver value to the digital transformation and IIoT journey, looks at how the private network space is developing, and considers where it could go next.

Material solutions for AI data center

Find out about Henkel Adhesive Technologies latest solutions for for AI in data centers

Material solutions for cloud/ hyperscale data center switches, routers and servers

Find out about our latest solutions for cloud/hyperscale data center switches, routers and servers.

Material solutions for wireless infrastructure 5G telecom solutions

Henkel’s advanced bonding and thermal solutions ensure reliable 5G performance in demanding conditions.

High-performance materials for telecom and datacom

Henkel’s advanced materials guarantee reliable, high-speed data transmission through optimized optical alignment, enhanced light transmittance, and superior heat management.

Small cells accelerate mobile broadband access with reliable performance enhanced by thermal control

This case study looks at how small cells accelerate mobile broadband access with reliable performance enhanced by thermal control.

Automation-friendly liquid gap filler delivers on thermal control

Learn how a manufacturer of a power converter used thermal management materials to create a more efficient product.

Heat dissipating gel for 5G infrastructure systems

This case study looks at how environmentally-stable, high thermal conductivity, heat-dissipating gel delivers critical cooling for 5G infrastructure systems.

Keep your cool

As network scale, speed, and bandwidth needs skyrocket and component density continues to increase, so does the heat generated within those circuits.

Network performance and the butterfly effect

As demands for greater bandwidth and faster speeds increase, the stress and strain on networks continues to grow.

The heat is on

Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.

Look small to go big

In today’s world of unprecedented network and infrastructure expansion, the need for increased performance and stability is accelerating. This rapid expansion is further challenged by the need to process more data at faster speeds while also accommodating emerging technology developments.

Looking for solutions? We can help

Company

Help

Resource center

Social media