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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal gels

BERGQUIST® LIQUI FORM TLF LF3500

For demanding, stay-in-place applications

A 1-part, gray, silicone-based, fully cured thermal interface gel designed for demanding applications.

Marketing materials

Part no. (SKU/IDH):
2196649

IDH Name:
BERGQUIST® LIQUI FORM TLF LF3500, 30 ml Syringe

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Information

BERGQUIST® LIQUI FORM TLF LF3500 is a thermally conductive, dispensable and highly conformable thermal management material with excellent chemical and mechanical stability. This product is designed to provide a balance between dispensability and low component stress during application and assembly, and the unique formulation offers excellent thermal performance and low applied stress.

  • Product category:
  • Thermal gels

Technologies:

  • Operating temperature:
  • -60.0 °C - 200.0 °C

 

  • Shelf life, @ 25.0 °C:
  • 365.0 day

 

  • Storage temperature:
  • 5.0 °C - 25.0 °C

 

  • Thermal conductivity:
  • 3.5 W/mK

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                 

                                   

                                     

                                       

                                         

                                           

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