Thermally conductive adhesives
Dispensable liquid for structural component bonding - extreme environments
2-part, liquid silicone adhesive designed to offer high bond strength and thermal conductivity in extreme environments.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
2167388
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® LIQUI BOND TLB SA3500 is a thermally conductive, high-performance adhesive material that, after mixing, begins to cure at room temperature but can also be accelerated by using heat. Once cured, this product maintains an excellent structural bond that can withstand severe environmental conditions and eliminates the need for mechanical fasteners. The mild elastic properties of the product assist in relieving Coefficient of Thermal Expansion (CTE) stresses during thermal cycling. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Eliminates need for mechanical fasteners
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Thermal Conductivity: 3.5 W/m-K (ASTM D5470)
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Maintains structural bond in severe-environment applications
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Room temperature storage
Product category:
Thermally conductive adhesives
Technologies:
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Thermal management, speciality liquids
Cure type:
Heat cure
Operating temperature:
-60.0 °C - 200.0 °C
Shelf life, @ 25.0 °C:
6.0 mon.
Thermal conductivity:
3.5 W/mK
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Large volume or special order?
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