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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials

BERGQUIST® GAP PAD TGP 7000ULM

Extremely soft, electrically insulating pad - high performance

A high performance, thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 7.0 W/m-K and ultra low modulus (ULM).

Part no. (SKU/IDH):
2563017

IDH Name:
BERGQUIST® GAP PAD TGP 7000ULM, 8″x8″ dimension, 0.020″ thickness

Part no. (SKU/IDH) 2563017
BERGQUIST® GAP PAD TGP 7000ULM, 8″x8″ dimension, 0.020″ thickness

Thickness Please make your selection 0.020″

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Information

BERGQUIST® GAP PAD TGP 7000ULM is an extremely soft and flexible material with a thermal conductivity rating of 7.0 W/m-K. The specially designed formulation offers exceptional thermal performance pressures due to using a unique filler package and ultra low modulus resin. This allows the material to be highly conforming to rough or irregular surfaces, providing excellent wet-out at the interface.

  • Product category:
  • Thermal GAP PAD Materials

Technologies:

  • Color:
  • Gray

 

  • Flame rating:
  • V-0

 

  • Operating temperature:
  • -60.0 °C - 200.0 °C

 

  • Standard thickness:
  • 0.5 mm - 3.18 mm

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                 

                                   

                                     

                                       

                                         

                                           

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