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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials


Extremely soft, electrically insulating pad - high performance

A high performance, thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 7.0 W/m-K and ultra low modulus (ULM).

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH) 2261480
BERGQUIST® GAP PAD TGP 7000ULM, 8″x8″ dimension, 0.040″ thickness

Thickness Please make your selection 0.040″



BERGQUIST® GAP PAD TGP 7000ULM is an extremely soft and flexible material with a thermal conductivity rating of 7.0 W/m-K. The specially designed formulation offers exceptional thermal performance pressures due to using a unique filler package and ultra low modulus resin. This allows the material to be highly conforming to rough or irregular surfaces, providing excellent wet-out at the interface.



Flame rating:


Operating temperature:

-60.0 °C - 200.0 °C

Standard thickness:

0.5 mm - 3.18 mm

Associated industries and market segments

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