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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials

BERGQUIST® GAP PAD TGP 6000ULM

Soft, electrically insulating pad - high performance

A high performance, thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 6.0 W/m-K and ultra low modulus (ULM).

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH) 2195669
BERGQUIST® GAP PAD TGP 6000ULM, 8″x16″ dimension, 0.080″ thickness

Thickness Please make your selection 0.080″

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Information

BERGQUIST® GAP PAD TGP 6000ULM is an extremely soft, thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.

Carrier type:

Fiberglass

Color:

Gray

Operating temperature:

-60.0 °C - 200.0 °C

Standard thickness:

1.524 mm - 3.175 mm

Associated industries and market segments

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