Phase change materials
Thin bond line, low pressure - for advanced devices
A breakthrough, unreinforced, thermally-conductive phase-change material designed for challenging designs in advanced computer and networking applications, offering superior thermal performance. With thin bond lines and low thermal impedance at both very low pressure (< 10 psi) and at higher pressure (> 35 psi), the formulation delivers excellent thermal capability while minimizing stress.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
BERGQUIST® HI FLOW THF 5000UT is a multi award-winning reworkable phase change thermal interface material designed for use between a heat sink and a variety of heat generating components. The material flows at its phase change temperature and conforms to the surface features of the components. During flow, air is expelled from the interface and thermal impedance is reduced, enabling highly efficient thermal transfer.
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Designed for thin, 25 µm (minimum) bond line with low thermal impedance (0.04° C-cm2/W at 35psi, 0.06° C-cm2/W at <10psi)
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Solid at room temperature, flows and fills the interface at target temperature 45°C (113° F)
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Thermal conductivity up to 8.5 W/m-K
Key characteristics:
Conductivity: thermally conductive,Reworkable