Henkel Adhesive Technologies

Henkel Adhesive Technologies

Phase change materials


Thin bond line, low pressure - for advanced devices

A breakthrough unreinforced, thermally conductive phase change material designed for challenging designs in advanced compute and networking applications offering superior thermal performance. With thin bond lines and low thermal impedance at very low pressure (< 10 psi) and at higher pressure (> 35 psi), the formulation delivers excellent thermal capability, while minimizing stress.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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BERGQUIST® HI FLOW THF 5000UT is a reworkable phase change thermal interface material suitable for use between a heat sink and variety heat generating components. The material flows at the phase change temperature, conforming to the surface features of the components. Upon flow, air is expelled from the interface, reducing thermal impedance, performing as a highly efficient thermal transfer material. Custom parts are also available upon request with low cost tooling.

For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.

Key characteristics:

Conductivity: Thermally Conductive,Reworkable

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