Part no. (SKU/IDH):
2917520
IDH Name:
BERGQUIST® HI FLOW THF 5000UT, 12 x 12 x 10 in
Phase change materials
Thin bond line, low pressure - for advanced devices
This breakthrough, unreinforced, thermally-conductive phase-change material is designed for challenging designs in advanced computer and networking applications, offering superior thermal performance. With thin bond lines and low thermal impedance at both very low pressure (< 10 psi) and at higher pressure (> 35 psi), the formulation delivers excellent thermal capability while minimizing stress.
Marketing materials
Part no. (SKU/IDH):
2917520
IDH Name:
BERGQUIST® HI FLOW THF 5000UT, 12 x 12 x 10 in
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® HI FLOW THF 5000UT is a multi-award-winning reworkable phase change thermal interface material designed for use between a heat sink and a variety of heat generating components. The material flows at its phase change temperature and conforms to the surface features of the components. During flow, air is expelled from the interface and thermal impedance is reduced, enabling highly efficient thermal transfer.
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Designed for thin, 25 µm (minimum) bond line with low thermal impedance (0.04°C / 32°F -cm2/W at 35psi, 0.06°C / 32.1°F -cm2/W at <10psi)
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Solid at room temperature, flows and fills the interface at target temperature 45°C (113° F)
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Thermal conductivity: 8.5 W/m-K
- Product category:
- Phase change materials
Technologies:
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Thermal management, speciality pads
- Key characteristics:
- Conductivity: thermally conductive; Reworkable
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Large volume or special order?
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