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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal gels

BERGQUIST® LIQUI FORM TLF 6000HG

For telecom market applications requiring high gap fill

One-part, gray, silicone-based, fully cured thermal interface gel specially formulated to provide a balanced mix of superior thermal reliability, good dispensing efficiency, and high thermal conductivity.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)
2624519

BERGQUIST® LIQUI FORM TLF 6000HG, 150 ml Dual cartridge

Documents

Information

Award-winning BERGQUIST® LIQUI FORM TLF 6000HG is a thermally conductive, dispensable, highly conformable thermal interface gel that provides electronic component thermal management capability within remote antennas and 5G base stations. It is ideal for filling larger gaps that measure up to 3.0mm, delivering robust vertical gap stability.

Flame rating:

V-0

Operating temperature:

-60.0 °C - 200.0 °C

Shelf life, @ 25.0 :

365.0 day

Thermal conductivity:

6.0 W/mK

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