For telecom market applications requiring high gap fill
One-part, gray, silicone-based, fully cured thermal interface gel specially formulated to provide a balanced mix of superior thermal reliability, good dispensing efficiency, and high thermal conductivity.
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- Technical specification
BERGQUIST® LIQUI FORM TLF 6000HG is a thermally conductive, dispensable and highly conformable thermal management material that effectively provides electronic component cooling capability for remote antenna assembly and 5G base stations. It is ideal for filling larger gaps that measure = 3mm and provides reliable vertical gap stability.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
-60.0 °C - 200.0 °C
Shelf life, @ 25.0 :