Thermal gels
For telecom market applications requiring high gap fill
One-part, gray, silicone-based, fully cured thermal interface gel specially formulated to provide a balanced mix of superior thermal reliability, good dispensing efficiency, and high thermal conductivity.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
BERGQUIST® LIQUI FORM TLF 6000HG is a thermally conductive, dispensable and highly conformable thermal management material that effectively provides electronic component cooling capability for remote antenna assembly and 5G base stations. It is ideal for filling larger gaps that measure
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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Dispensable pre-cured gel, requiring no mixing or refrigeration
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Thermal conductivity: 6.0 W/m-K
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Stable viscosity in storage and in the application
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Excellent chemical stability and mechanical stability
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Low compression set to reduce stress on components
Flame rating:
V-0
Operating temperature:
-60.0 °C - 200.0 °C
Shelf life, @ 25.0 :
365.0 day
Thermal conductivity:
6.0 W/mK