Case study

BERGQUIST^® LIQUI-BOND^® delivers efficient solution for data center power supply

Learn how a manufacturer of an AC/DC power supply leverages a robust thermal management solution for its compact design.

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We, Henkel Corporation would like to personalize our digital services, retail activities and online advertising based on an analysis of your interactions with us, our websites and services (as stated under read more), to provide you and the company you are representing, with the most relevant and interesting content.

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Graphic of an ac-dc power device exploded.

Customer challenge

The customer’s new AC/DC power supply for cloud and hyperscale data centers required a robust thermal management solution for its compact design.

Different substrate surface topographies across the device dictated an adaptable material that could accommodate for dimensional variations to maximize thermal transfer.

Secure parts, dissipate heat and reduce mechanical stress while working within the space constraints of the new design.

Key results

Improved productivity and output rates by 20 to 30%
Improved overall total manufacturing cost by 15 to 20%
Streamlined inventory and reduced supply complexity, translating to 15 to 30% additional opportunity cost for the customers´ system
Ensured minimal device stress
Secured reliability by delivering a more compact power solution

Resources

Article
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Case study
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White paper

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Material solutions for wireless infrastructure 5G telecom solutions

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White paper

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BERGQUIST® LIQUI-BOND® delivers efficient solution for data center power supply

Get access now

Customer challenge

Key results

Resources

How advanced materials help slow runaway data center costs

Learn how specifying advanced materials in circuit board construction can help stem rising costs in limited IT budgets.

Your data center is under water and hotter than ever

Anyone who’s jumped in a cold pool on a hot day understands the effectiveness of liquid cooling. This is certainly not a new concept. Automobile radiators, one of the first examples of liquid cooling in industry, have existed for nearly 125 years.

Delivering long-term data center sustainability

In this article, we consider the key priorities for delivering data center sustainability, and the steps being taken to meet them.

Does immersion cooling offer a route to the sustainable data center?

This article looks at immersion cooling as one such technology, weighs up its benefits and challenges, and considers whether the drive for data center sustainability will be enough to take it from niche to mainstream adoption.

Honeycomb ventilation for the data center

The honeycomb core-to-vent frame attachment is a critical aspect of data center design, and selecting the right adhesive can contribute to achieving the ultimate sweet spot of balancing performance, cost and product lifetime.

800G/1.6T optics powering AI revolution

Explore how 800G and 1.6T optics are helping turn AI evolution into revolution by enhancing data center speed and efficiency. Discover how Henkel are driving innovation to meet the growing demands of AI applications.

Material solutions for AI data center

Find out about Henkel Adhesive Technologies latest solutions for for AI in data centers

Material solutions for cloud/ hyperscale data center switches, routers and servers

Find out about our latest solutions for cloud/hyperscale data center switches, routers and servers.

Material solutions for wireless infrastructure 5G telecom solutions

Henkel’s advanced bonding and thermal solutions ensure reliable 5G performance in demanding conditions.

High-performance materials for telecom and datacom

Henkel’s advanced materials guarantee reliable, high-speed data transmission through optimized optical alignment, enhanced light transmittance, and superior heat management.

Phase change interface materials for next-gen data center ICs

This case study looks at how low-pressure, low thermal impedance, phase change thermal interface material provides a much-needed solution for next-gen data center ICs.

Durable TIM coating reduces heat and improves data center switch performance

This case study looks at how durable, thin thermal interface coating reduces heat and improves data center switch performance.

Keep your cool

As network scale, speed, and bandwidth needs skyrocket and component density continues to increase, so does the heat generated within those circuits.

Network performance and the butterfly effect

As demands for greater bandwidth and faster speeds increase, the stress and strain on networks continues to grow.

The heat is on

Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.

Look small to go big

In today’s world of unprecedented network and infrastructure expansion, the need for increased performance and stability is accelerating. This rapid expansion is further challenged by the need to process more data at faster speeds while also accommodating emerging technology developments.

The 2023 data center pulse report

With an insatiable demand for faster networking speeds and throughput performance within the data center, 800 Gigabit Ethernet (GbE) is gaining momentum as the next big trend in networking to provide capacity to ever-growing customer demands.

The 2024 data center pulse report

The influence of innovation and technology on the need to transition from 800G to 1.6T.

Looking for solutions? We can help

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BERGQUIST^® LIQUI-BOND^® delivers efficient solution for data center power supply