Case study
Learn how a manufacturer of an AC/DC power supply leverages a robust thermal management solution for its compact design.
The customer’s new AC/DC power supply for cloud and hyperscale data centers required a robust thermal management solution for its compact design.
Different substrate surface topographies across the device dictated an adaptable material that could accommodate for dimensional variations to maximize thermal transfer.
Secure parts, dissipate heat and reduce mechanical stress while working within the space constraints of the new design.
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