Case study

BERGQUIST^® LIQUI-BOND^® delivers efficient solution for data center power supply

Learn how a manufacturer of an AC/DC power supply leverages a robust thermal management solution for its compact design.

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Graphic of an ac-dc power device exploded.

Customer challenge

The customer’s new AC/DC power supply for cloud and hyperscale data centers required a robust thermal management solution for its compact design.

Different substrate surface topographies across the device dictated an adaptable material that could accommodate for dimensional variations to maximize thermal transfer.

Secure parts, dissipate heat and reduce mechanical stress while working within the space constraints of the new design.

Key results

Improved productivity and output rates by 20 to 30%
Improved overall total manufacturing cost by 15 to 20%
Streamlined inventory and reduced supply complexity, translating to 15 to 30% additional opportunity cost for the customers´ system
Ensured minimal device stress
Secured reliability by delivering a more compact power solution

Resources

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BERGQUIST^® LIQUI-BOND^® delivers efficient solution for data center power supply

Get access now

Customer challenge

Key results

Resources

How advanced materials help slow runaway data center costs

Learn how specifying advanced materials in circuit board construction can help stem rising costs in limited IT budgets.

Your data center is under water and hotter than ever

Anyone who’s jumped in a cold pool on a hot day understands the effectiveness of liquid cooling. This is certainly not a new concept. Automobile radiators, one of the first examples of liquid cooling in industry, have existed for nearly 125 years.

Delivering long-term data center sustainability

In this article, we consider the key priorities for delivering data center sustainability, and the steps being taken to meet them.

Honeycomb ventilation for the data center

The honeycomb core-to-vent frame attachment is a critical aspect of data center design, and selecting the right adhesive can contribute to achieving the ultimate sweet spot of balancing performance, cost and product lifetime.

Material solutions for AI data center

Find out about Henkel Adhesive Technologies latest solutions for for AI in data centers

Material solutions for cloud/ hyperscale data center switches, routers and servers

Find out about our latest solutions for cloud/hyperscale data center switches, routers and servers.

Material solutions for wireless infrastructure 5G telecom solutions

Henkel’s advanced bonding and thermal solutions ensure reliable 5G performance in demanding conditions.

High-performance materials for telecom and datacom

Henkel’s advanced materials guarantee reliable, high-speed data transmission through optimized optical alignment, enhanced light transmittance, and superior heat management.

Phase change interface materials for next-gen data center ICs

This case study looks at how low-pressure, low thermal impedance, phase change thermal interface material provides a much-needed solution for next-gen data center ICs.

Durable TIM coating reduces heat and improves data center switch performance

This case study looks at how durable, thin thermal interface coating reduces heat and improves data center switch performance.

The heat is on

Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.

Look small to go big

In today’s world of unprecedented network and infrastructure expansion, the need for increased performance and stability is accelerating. This rapid expansion is further challenged by the need to process more data at faster speeds while also accommodating emerging technology developments.

Find the right expert

Company

Help

Resource center

Social media

BERGQUIST® LIQUI-BOND® delivers efficient solution for data center power supply

Get access now

Customer challenge

Key results

Resources

How advanced materials help slow runaway data center costs

Learn how specifying advanced materials in circuit board construction can help stem rising costs in limited IT budgets.

Your data center is under water and hotter than ever

Anyone who’s jumped in a cold pool on a hot day understands the effectiveness of liquid cooling. This is certainly not a new concept. Automobile radiators, one of the first examples of liquid cooling in industry, have existed for nearly 125 years.

Delivering long-term data center sustainability

In this article, we consider the key priorities for delivering data center sustainability, and the steps being taken to meet them.

Honeycomb ventilation for the data center

The honeycomb core-to-vent frame attachment is a critical aspect of data center design, and selecting the right adhesive can contribute to achieving the ultimate sweet spot of balancing performance, cost and product lifetime.

Material solutions for AI data center

Find out about Henkel Adhesive Technologies latest solutions for for AI in data centers

Material solutions for cloud/ hyperscale data center switches, routers and servers

Find out about our latest solutions for cloud/hyperscale data center switches, routers and servers.

Material solutions for wireless infrastructure 5G telecom solutions

Henkel’s advanced bonding and thermal solutions ensure reliable 5G performance in demanding conditions.

High-performance materials for telecom and datacom

Henkel’s advanced materials guarantee reliable, high-speed data transmission through optimized optical alignment, enhanced light transmittance, and superior heat management.

Phase change interface materials for next-gen data center ICs

This case study looks at how low-pressure, low thermal impedance, phase change thermal interface material provides a much-needed solution for next-gen data center ICs.

Durable TIM coating reduces heat and improves data center switch performance

This case study looks at how durable, thin thermal interface coating reduces heat and improves data center switch performance.

The heat is on

Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.

Look small to go big

In today’s world of unprecedented network and infrastructure expansion, the need for increased performance and stability is accelerating. This rapid expansion is further challenged by the need to process more data at faster speeds while also accommodating emerging technology developments.

Find the right expert

Company

Help

Resource center

Social media

BERGQUIST^® LIQUI-BOND^® delivers efficient solution for data center power supply