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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Part no. (SKU/IDH):
2166508

IDH Name:
BERGQUIST® GAP FILLER TGF 3600, 50 ml Dual cartridge

Thermal gap fillers

BERGQUIST® GAP FILLER TGF 3600

Versatile, high-performance dispensable liquid

This highly thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It has excellent low- and high-temperature, mechanical and chemical stability.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Information

BERGQUIST® GAP FILLER TGF 3600 is a 3.6 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). It exhibits ultra-high thermal performance and superior softness. This product has low modulus to help relieve coefficient of thermal expansion (CTE) stresses in thermal cycling and provide excellent vertical gap stability. It can be used for fragile and low stress applications in various fields. This product is curable at room temperature. However, the cure rate can be accelerated with the application of heat.

  • Product category:
  • Thermal gap fillers

Technologies:

  • Cure type:
  • Heat cure

 

  • Flame rating:
  • V-0

 

  • Hardener: Color:
  • Blue

 

  • Mixed: Color:
  • Blue

 

  • Operating temperature:
  • -60.0 °C - 200.0 °C

 

  • Resin: Color:
  • White

 

  • Thermal conductivity:
  • 3.6 W/mK

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                 

                                   

                                     

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