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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal gap fillers


Versatile, high-performance dispensable liquid

A highly thermally-conductive liquid gap filler for easy, precision dispensing and low stress assembly. Excellent low and high temperature, mechanical and chemical stability.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)

BERGQUIST® GAP FILLER TGF 3600, 50 ml Dual cartridge



BERGQUIST® GAP FILLER TGF 3600 is a 3.6 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). It exhibits ultra-high thermal performance and superior softness. This product has low modulus to help relieve CTE stresses in thermal cycling and provide excellent vertical gap stability. It can be used for fragile and low stress applications in various fields. This product is curable at room temperature. However, the cure rate can be accelerated with application of heat. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.

Cure type:

Heat cure

Flame rating:


Hardener: Color:


Mixed: Color:


Operating temperature:

-60.0 °C - 200.0 °C

Resin: Color:


Thermal conductivity:

3.6 W/mK

Associated industries and market segments

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