Thermal gap fillers
Versatile, high-performance dispensable liquid
A highly thermally-conductive liquid gap filler for easy, precision dispensing and low stress assembly. Excellent low and high temperature, mechanical and chemical stability.
2166508
BERGQUIST® GAP FILLER TGF 3600, 50 ml Dual cartridge
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® GAP FILLER TGF 3600 is a 3.6 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). It exhibits ultra-high thermal performance and superior softness. This product has low modulus to help relieve CTE stresses in thermal cycling and provide excellent vertical gap stability. It can be used for fragile and low stress applications in various fields. This product is curable at room temperature. However, the cure rate can be accelerated with application of heat. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Thermal conductivity: 3.6 W/m-K
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Ultra low modulus
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Ultra conforming
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Easily dispensable
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UL94 V-0 compliance
- Product category:
- Thermal gap fillers
Technologies:
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Thermal management, standard viscosity liquids
- Cure type:
- Heat cure
- Flame rating:
- V-0
- Hardener: Color:
- Blue
- Mixed: Color:
- Blue
- Operating temperature:
- -60.0 °C - 200.0 °C
- Resin: Color:
- White
- Thermal conductivity:
- 3.6 W/mK
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Large volume or special order?
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