Case study

Henkel optimizes thermal performance for an industrial autonomous guided vehicle

Learn how the manufacturer of an autonomous guided vehicle dissipated heat for optimized function with Henkel thermal management materials.

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We, Henkel Corporation would like to personalize our digital services, retail activities and online advertising based on an analysis of your interactions with us, our websites and services (as stated under read more), to provide you and the company you are representing, with the most relevant and interesting content.

In particular, we will analyze your use of (1) our newsletter and other e-mail advertisements, (2) our websites, as well as (3) your previous interactions with us, including inquiries and complaints you have issued and purchases you have made for your company, (4) your participation in online and offline events (either hosted by us or a third party), (5) your engagement with our online advertisements on our website as well as third party websites and apps, and (6) the publicly accessible information contained in your professional social media profiles, as well as anonymize any such information in order to enable further analysis of your interactions with us without being able to attribute any such information to you.

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I want to receive the personalized Newsletter and other E-Mail advertisements from you, based on the analysis of my personal data as described above providing me with personalized and up to date information on all products and proposals in the field of Adhesives relevant to me and/or my company.

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I want advertisements for your products and events regarding adhesives shown to me on Facebook and LinkedIn to be personalized based on the analysis of my personal data as described above. My email address and/or my user ID will be transferred to Meta Platforms Ireland Ltd., 4 Grand Canal Square, Grand Canal Harbour, Dublin 2 Ireland and LinkedIn Corporation, 1000 W. Maude Avenue, Sunnyvale, CA 94085, USA for this purpose.

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An example of Thermal GAP PAD<sup>®</sup>

Customer challenge

A new electronic control unit (ECU) design incorporates a large processor IC that requires excellent heat dissipation for optimized function. The system is sensitive and outgassing minimization is necessary to avoid interference with other components.

Key results

Exceptional high compliance and softness for very low assembly stress
Thorough gap filling for optimized thermal transfer with a thermal conductivity of 3.0 W/m-K
Easy handling for production efficiency
Low outgassing formulation reduces concerns of contamination exposure
Protected sensitive components from residue interference

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Keep your cool

As network scale, speed, and bandwidth needs skyrocket and component density continues to increase, so does the heat generated within those circuits.

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Network performance and the butterfly effect

As demands for greater bandwidth and faster speeds increase, the stress and strain on networks continues to grow.

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Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.

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White paper

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Henkel optimizes thermal performance for an industrial autonomous guided vehicle

Get access now

Customer challenge

Key results

Resources

How advanced materials help slow runaway data center costs

Learn how specifying advanced materials in circuit board construction can help stem rising costs in limited IT budgets.

Your data center is under water and hotter than ever

Anyone who’s jumped in a cold pool on a hot day understands the effectiveness of liquid cooling. This is certainly not a new concept. Automobile radiators, one of the first examples of liquid cooling in industry, have existed for nearly 125 years.

Delivering long-term data center sustainability

In this article, we consider the key priorities for delivering data center sustainability, and the steps being taken to meet them.

Does immersion cooling offer a route to the sustainable data center?

This article looks at immersion cooling as one such technology, weighs up its benefits and challenges, and considers whether the drive for data center sustainability will be enough to take it from niche to mainstream adoption.

Honeycomb ventilation for the data center

The honeycomb core-to-vent frame attachment is a critical aspect of data center design, and selecting the right adhesive can contribute to achieving the ultimate sweet spot of balancing performance, cost and product lifetime.

800G/1.6T optics powering AI revolution

Explore how 800G and 1.6T optics are helping turn AI evolution into revolution by enhancing data center speed and efficiency. Discover how Henkel are driving innovation to meet the growing demands of AI applications.

Material solutions for AI data center

Find out about Henkel Adhesive Technologies latest solutions for for AI in data centers

Material solutions for cloud/ hyperscale data center switches, routers and servers

Find out about our latest solutions for cloud/hyperscale data center switches, routers and servers.

Material solutions for wireless infrastructure 5G telecom solutions

Henkel’s advanced bonding and thermal solutions ensure reliable 5G performance in demanding conditions.

High-performance materials for telecom and datacom

Henkel’s advanced materials guarantee reliable, high-speed data transmission through optimized optical alignment, enhanced light transmittance, and superior heat management.

Phase change interface materials for next-gen data center ICs

This case study looks at how low-pressure, low thermal impedance, phase change thermal interface material provides a much-needed solution for next-gen data center ICs.

Durable TIM coating reduces heat and improves data center switch performance

This case study looks at how durable, thin thermal interface coating reduces heat and improves data center switch performance.

Keep your cool

As network scale, speed, and bandwidth needs skyrocket and component density continues to increase, so does the heat generated within those circuits.

Network performance and the butterfly effect

As demands for greater bandwidth and faster speeds increase, the stress and strain on networks continues to grow.

The heat is on

Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.

Look small to go big

In today’s world of unprecedented network and infrastructure expansion, the need for increased performance and stability is accelerating. This rapid expansion is further challenged by the need to process more data at faster speeds while also accommodating emerging technology developments.

Looking for solutions? We can help

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