Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal gap fillers


Dispensable liquid with controlled outgassing

A high thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly. Controlled volatile outgassing for silicone sensitive applications.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH) 2711513
BERGQUIST GAP FILLER TGF 4500CVO, 50 ml Dual cartridge

Size Please make your selection 50 ml

Please contact us for ordering options



BERGQUIST® GAP FILLER TGF 4500CVO is a 4.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). The silicone-based material offers infinite thickness variation without causing additional stress to components, and the formula ensures optimal viscosity for efficient automated dispensing processes. This product is curable at room temperature however, the cure rate can also be accelerated with application of heat.

For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.

Cure type:

Heat Cure,Room Temperature (Ambient) Cure

Operating temperature:

-60.0 °C - 200.0 °C

Shelf life, @ 25.0 °C:

180.0 day

Thermal conductivity:

4.5 W/mK

Please contact us for ordering options

You might also need

  • LOCTITE 50ml Dual Cartridge Handheld Manual Applicator (IDH 267452)

    Dispense systems

    LOCTITE® Dual Cartridge Manual Applicator, 50ml


Request a consultation

Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.