Thermal gap fillers
Dispensable liquid with controlled outgassing
A high thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly. Controlled volatile outgassing for silicone sensitive applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® GAP FILLER TGF 4500CVO is a 4.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). It offers infinite thickness variation without causing additional stress to components, and the formula ensures optimal viscosity for efficient automated dispensing processes. This product is curable at room temperature, but the cure rate can be accelerated by applying heat.
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Thermal conductivity: 4.5 W/mK
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Extended working time for manufacturing flexibility
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Controlled volatile silicones
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High dispensing rate
- Product category:
- Thermal gap fillers
Technologies:
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Thermal management, standard viscosity liquids
- Cure type:
- Heat cure,Room temperature (ambient) cure
- Operating temperature:
- -60.0 °C - 200.0 °C
- Shelf life, @ 25.0 °C:
- 180.0 day
- Thermal conductivity:
- 4.5 W/mK
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Large volume or special order?
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