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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal gap fillers

BERGQUIST® GAP FILLER TGF 4500CVO

Dispensable liquid with controlled outgassing

A high thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly. Controlled volatile outgassing for silicone sensitive applications.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH) 2711513
BERGQUIST® GAP FILLER TGF 4500CVO, 50 ml Dual cartridge

Documents

Information

BERGQUIST® GAP FILLER TGF 4500CVO is a 4.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). It offers infinite thickness variation without causing additional stress to components, and the formula ensures optimal viscosity for efficient automated dispensing processes. This product is curable at room temperature, but the cure rate can be accelerated by applying heat.

Product category:

Thermal gap fillers

Technologies:

Cure type:

Heat cure,Room temperature (ambient) cure

Operating temperature:

-60.0 °C - 200.0 °C

Shelf life, @ 25.0 °C:

180.0 day

Thermal conductivity:

4.5 W/mK

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