Thermal gap fillers
Dispensable liquid with controlled outgassing
A high thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly. Controlled volatile outgassing for silicone sensitive applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
Size Please make your selection 50 ml
- Technical specification
BERGQUIST® GAP FILLER TGF 4500CVO is a 4.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). The silicone-based material offers infinite thickness variation without causing additional stress to components, and the formula ensures optimal viscosity for efficient automated dispensing processes. This product is curable at room temperature however, the cure rate can also be accelerated with application of heat.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
Heat Cure,Room Temperature (Ambient) Cure
-60.0 °C - 200.0 °C
Shelf life, @ 25.0 °C: