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      Thermal gap fillers

      BERGQUIST® GAP FILLER TGF 1500LVO

      Versatile dispensable liquid with low outgassing

      A thermally-conductive liquid gap filler for easy, precision dispensing and low stress assembly. Low volatile outgassing for silicone sensitive applications.

      All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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      Part no. (SKU/IDH)
      2179523

      BERGQUIST® GAP FILLER TGF 1500LVO, 50 ml Dual cartridge

      Documents

      Technical (1)

      RoHS (2)

      Regulatory (2)

      Information

      BERGQUIST® GAP FILLER TGF 1500LVO is a 1.5 W/m-K thermally conductive, ultra-conforming, silicone-based liquid gap filler (2-part). It offers high temperature resistance and is proven to have significantly lower levels of silicone outgassing. It cures at room temperature or can be accelerated using heat, and is ideal for fragile applications or those that don't require a strong bond due to a lower level of adhesion strength. This product is curable at room temperature. However, the cure rate can be accelerated with application of heat. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
      • Thermal conductivity: 1.8 W/mK
      • Low volatility for outgassing and silicone sensitive applications
      • Ultra-conforming, with excellent wet-out
      • 100% solids — no cure by-products

      Product category:

      Thermal gap fillers

      Technologies:

      • Thermal management, standard viscosity liquids

      Cure type:

      Heat cure

      Flame rating:

      V-0

      Hardener: Color:

      White

      Mixed: Color:

      Yellow

      Resin: Color:

      Yellow

      Thermal conductivity:

      1.8 W/mK

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