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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Thermal gap fillers

BERGQUIST® GAP FILLER TGF 1500LVO

Versatile dispensable liquid with low outgassing

A thermally-conductive liquid gap filler for easy, precision dispensing and low stress assembly. Low volatile outgassing for silicone sensitive applications.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)
2179523

BERGQUIST® GAP FILLER TGF 1500LVO, 50 ml Dual cartridge

Documents

Information

BERGQUIST® GAP FILLER TGF 1500LVO is a 1.5 W/m-K thermally conductive, ultra-conforming, silicone-based liquid gap filler (2-part). It offers high temperature resistance and is proven to have significantly lower levels of silicone outgassing. It cures at room temperature or can be accelerated using heat, and is ideal for fragile applications or those that don't require a strong bond due to a lower level of adhesion strength. This product is curable at room temperature. However, the cure rate can be accelerated with application of heat. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.

  • Product category:
  • Thermal gap fillers

Technologies:

  • Cure type:
  • Heat cure

 

  • Flame rating:
  • V-0

 

  • Hardener: Color:
  • White

 

  • Mixed: Color:
  • Yellow

 

  • Resin: Color:
  • Yellow

 

  • Thermal conductivity:
  • 1.8 W/mK

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                 

                                   

                                     

                                       

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