Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal gap fillers


Versatile dispensable liquid with low outgassing

A thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly. Low volatile outgassing for silicone sensitive applications.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)

BERGQUIST GAP FILLER TGF 1500LVO, 50 ml Dual cartridge

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BERGQUIST® GAP FILLER TGF 1500LVO is a 1.5 W/m-K thermally conductive,ultra-conforming, silicone-based liquid gap filler (2-part). It offers high temperature resistance and is proven to have significantly lower levels of silicone outgassing. BERGQUIST GAP FILLER TGF 1500LVO cures at room temperature or can be accelerated using heat and is ideal for applications that are fragile or do not require a strong bond due to a lower level of adhesion strength. This product is curable at room temperature however, the cure rate can also be accelerated with application of heat.

For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.

Cure type:

Heat Cure

Flame rating:


Hardener: Color:


Mixed: Color:


Resin: Color:


Thermal conductivity:

1.8 W/mK

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