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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal gap fillers


Versatile dispensable liquid with low outgassing

A thermally-conductive liquid gap filler for easy, precision dispensing and low stress assembly. Low volatile outgassing for silicone sensitive applications.

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Part no. (SKU/IDH)

BERGQUIST® GAP FILLER TGF 1500LVO, 50 ml Dual cartridge



BERGQUIST® GAP FILLER TGF 1500LVO is a 1.5 W/m-K thermally conductive, ultra-conforming, silicone-based liquid gap filler (2-part). It offers high temperature resistance and is proven to have significantly lower levels of silicone outgassing. It cures at room temperature or can be accelerated using heat, and is ideal for fragile applications or those that don't require a strong bond due to a lower level of adhesion strength. This product is curable at room temperature. However, the cure rate can be accelerated with application of heat. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.

Cure type:

Heat cure

Flame rating:


Hardener: Color:


Mixed: Color:


Resin: Color:


Thermal conductivity:

1.8 W/mK

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