Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal gap fillers

BERGQUIST GAP FILLER TGF 1500LVO

Versatile dispensable liquid with low outgassing

A thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly. Low volatile outgassing for silicone sensitive applications.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)
2179523

BERGQUIST GAP FILLER TGF 1500LVO, 50 ml Dual cartridge

Please contact us for ordering options

Documents

Information

BERGQUIST® GAP FILLER TGF 1500LVO is a 1.5 W/m-K thermally conductive,ultra-conforming, silicone-based liquid gap filler (2-part). It offers high temperature resistance and is proven to have significantly lower levels of silicone outgassing. BERGQUIST GAP FILLER TGF 1500LVO cures at room temperature or can be accelerated using heat and is ideal for applications that are fragile or do not require a strong bond due to a lower level of adhesion strength. This product is curable at room temperature however, the cure rate can also be accelerated with application of heat.

For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.

Cure type:

Heat Cure

Flame rating:

V-0

Hardener: Color:

White

Mixed: Color:

Yellow

Resin: Color:

Yellow

Thermal conductivity:

1.8 W/mK

Please contact us for ordering options

You might also need

  • LOCTITE 50ml Dual Cartridge Handheld Manual Applicator (IDH 267452)

    Dispense systems

    LOCTITE® Dual Cartridge Manual Applicator, 50ml

    ...

Request a consultation

Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.