Thermal gap fillers
Versatile, cost-effective dispensable liquid
A thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Technical specification
BERGQUIST® GAP FILLER TGF 1500 is a 1.5 W/m-K thermally conductive, ultra-conforming, silicone-based liquid gap filler (2-part). It features superior slump resistance and high shear thinning characteristics resulting in optimum consistency and control during dispense. It also exhibits excellent low and high temperature mechanical and chemical stability. It is therefore ideal for use between any heat source and sink. This product is curable at room temperature however, the cure rate can also be accelerated with application of heat.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
-60.0 °C - 200.0 °C