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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal gap fillers


Versatile, cost-effective dispensable liquid

A thermally-conductive liquid gap filler for easy, precision dispensing and low stress assembly. Low volatile outgassing for silicone sensitive applications.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)

BERGQUIST® GAP FILLER TGF 1500, 50 ml Dual cartridge



BERGQUIST® GAP FILLER TGF 1500 is a 1.5 W/m-K thermally conductive, ultra-conforming, silicone-based liquid gap filler (2-part). It features superior slump resistance and high shear thinning characteristics, resulting in optimum consistency and control during dispense. It also exhibits excellent low- and high-temperature mechanical and chemical stability. It is therefore ideal for use between any heat source and sink. This product is curable at room temperature. However, the cure rate can be accelerated with application of heat. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.

Cure type:

Heat cure

Flame rating:


Hardener: Color:


Mixed: Color:


Operating temperature:

-60.0 °C - 200.0 °C

Resin: Color:


Thermal conductivity:

1.8 W/mK

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