Skip to Content
Henkel Adhesive Technologies

Henkel Adhesive Technologies

Loctite Technology Cluster Brand for Product Detail Pages

Thermal gap fillers


High performance gap-filler for e-mobility battery applications

A highly thermally-conductive liquid gap filler for easy, fast dispensing and low stress assembly. Ideal for high throughput applications like automotive power storage systems in the automotive industry.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Please contact us for ordering options



When you need a combination of excellent thermal conductivity, high dispense rate and low compressive stress, BERGQUIST® GAP FILLER TGF 3010APS is an excellent fit. This specially-formulated silicone-free, 2-part gap filler offers a dispense rate of up to 80 cc/sec, a 3.0 W/m-K thermal performance, and cures at room temperature. It is designed for silicone sensitive application to have low stress, avoiding damage during battery module assembly.

Product category:

Thermal gap fillers


Cure type:

Heat cure

Flame rating:


Hardener: Color:


Mixed: Color:


Operating temperature:

-40.0 °C - 80.0 °C

Resin: Color:


Thermal conductivity:

3.0 W/mK

Please contact us for ordering options

There are some errors, please correct them below.

Recently viewed products

Request a consultation

Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.