Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal gap fillers

BERGQUIST TGF 3010APS

High performance, electrically insulating thermally-conductive gap-filler for e-mobility battery applications

A high thermally-conductive liquid gap filler for easy, fast dispensing and low stress assembly. Ideal for high throughput applications like automotive power storage systems in the automotive industry. 

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Documents

Information

When you need a combination of excellent thermal conductivity, high dispense rate and low compressive stress, BERGQUIST GAP FILLER TGF 3010APS is an excellent fit. This special formulated silicone-free, 2-part gap filler offers a dispense rate of up to 80 cc/sec, a 3.0 W/m-K thermal performance, and cures at room temperature. It is designed for silicone sensitive application to have low stress, avoiding damage during battery module assembly.

Cure type:

Heat Cure

Flame rating:

V-0

Hardener: Color:

White

Mixed: Color:

Black

Operating temperature:

-40.0 °C - 80.0 °C

Resin: Color:

Black

Thermal conductivity:

3.0 W/mK

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