Part no. (SKU/IDH):
2448046
IDH Name:
BERGQUIST GAP FILLER TGF 3010APS
Thermal gap fillers
High performance dispensable liquid for e-Mobility battery applications
This highly thermally conductive liquid gap filler has easy, fast dispensing and low stress assembly, and is ideal for high throughput applications like EV battery applications and automotive power storage systems.
Part no. (SKU/IDH):
2448046
IDH Name:
BERGQUIST GAP FILLER TGF 3010APS
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® GAP FILLER TGF 3010APS is a silicone-free, 2-part gap filler with a dispense rate of up to 80 cc/sec, a 3.0 W/m-K thermal performance, and room temperature cure. It is designed for low-stress silicone sensitive application, avoiding damage during battery module assembly. A great product when you need a combination of excellent thermal conductivity, high dispense rate and low compressive stress.
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Very high dispense rate
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Low compression force
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Room temperature cure
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High thermal conductivity: 3 W/mK
- Product category:
- Thermal gap fillers
Technologies:
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Thermal management, high volume liquids
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Thermal management, standard viscosity liquids
- Cure type:
- Heat cure
- Flame rating:
- V-0
- Hardener: Color:
- White
- Mixed: Color:
- Black
- Operating temperature:
- -40.0 °C - 80.0 °C
- Resin: Color:
- Black
- Thermal conductivity:
- 3.0 W/mK
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Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
