Thermal gap fillers
High performance gap-filler for e-Mobility battery applications
This highly thermally conductive liquid gap filler has easy, fast dispensing and low stress assembly, and is ideal for high throughput applications like EV battery applications and automotive power storage systems.
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® GAP FILLER TGF 3010APS is a silicone-free, 2-part gap filler with a dispense rate of up to 80 cc/sec, a 3.0 W/m-K thermal performance, and room temperature cure. It is designed for low-stress silicone sensitive application, avoiding damage during battery module assembly. A great product when you need a combination of excellent thermal conductivity, high dispense rate and low compressive stress.
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Very high dispense rate
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Low compression force
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Room temperature cure
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High thermal conductivity of 3 W/mK
- Product category:
- Thermal gap fillers
Technologies:
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Thermal management, high volume liquids
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Thermal management, standard viscosity liquids
- Cure type:
- Heat cure
- Flame rating:
- V-0
- Hardener: Color:
- White
- Mixed: Color:
- Black
- Operating temperature:
- -40.0 °C - 80.0 °C
- Resin: Color:
- Black
- Thermal conductivity:
- 3.0 W/mK
