Skip to Content
Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal gels

BERGQUIST® LIQUI FORM TLF 10000

High performance, telecom market applications

A 1-part, red, silicone-based, fully-cured thermal interface gel designed for high power industrial infrastructure electronics systems.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)
2746330

BERGQUIST® LIQUI FORM TLF 10000

Documents

Information

BERGQUIST® LIQUI FORM TLF 10000 is a thermally conductive, dispensable, highly conformable gel thermal interface material designed to meet the demanding requirements of datacom, telecom, and industrial automation applications. Its unique formulation delivers a balanced mix of high thermal conductivity, dispensing efficiency, and high reliability. This material is designed to provide efficient heat transfer between high-power electronic components and heat sinks. Recognized for its importance in optimizing electronics performance, the high thermal conductivity gel has won several industry awards.

Flame rating:

V-0

Operating temperature:

-60.0 °C - 200.0 °C

Shelf life, @ 0.0 °C:

180.0 day

Thermal conductivity:

10.0 W/mK

Associated industries and market segments

Request a consultation

Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.