High performance, telecom market applications
A one-part, red, silicone-based, fully cured thermal interface gel designed for high power industrial infrastructure electronics systems.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Technical specification
BERGQUIST® LIQUI FORM TLF 10000 is a thermally conductive, dispensable and highly conformable gel interface material is designed to meet the demanding requirements in telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal reliability. This material is specially designed to provide effective electronic component cooling capability for 5G base station and remote antenna assembly where a highly reliable vertical gap stability is required.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
-60.0 °C - 200.0 °C
Shelf life, @ 0.0 °C: