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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal gels


Highly thermally-conductive gel for demanding applications

Silicone-based, 1-part thermally-conductive gel, ideal for applications where highly reliable vertical gap stability is required.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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BERGQUIST® LIQUI FORM TLF 3500CGEL is a 1-part, high performance, thermally conductive gel specially designed for demanding high-reliability applications. It will cure from within the application at room temperature, and cure can be accelerated by applying heat. Once cured, you can expect a soft, thermally conductive, form-in place elastomer ideal for fragile assemblies, and capable of filling unique and intricate air voids and gaps. Designed for applications requiring high reliability and challenging vertical gaps where work of adhesion muct overcome gravity, shock and vibration, this product’s unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency, and high thermal reliability.



Cure schedule, @ 100.0 °C (150.0 °C):

60.0 min. (30.0 min.)

Cure type:

Heat cure

Flame rating:


Operating temperature:

-60.0 °C - 200.0 °C

Shelf life, @ -20.0 °C:

270.0 day

Thermal conductivity:

3.5 W/mK

Please contact us for ordering options

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