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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Thermal GAP PAD Materials

BERGQUIST® GAP PAD® TGP 1350

Reworkable, thermally-conductive gap pad for fragile components

This silicone, thermally-conductive and reworkable gap pad is highly conformable, easily compressable, and is reinforced with a PEN film for rework and improved resistance to puncture and tear.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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Information

When you need a thermally conductive gap pad for fragile components, try BERGQUIST® GAP PAD TGP 1350. This silicone-based pad is highly conformable and compliant, and reinforced with a PEN film. This not only allows rework, but also improves resistance to puncture and tear. It’s highly durable and UL 94 V-0 compliant.

  • Product category:
  • Thermal GAP PAD Materials

Technologies:

  • Carrier type:
  • PEN film

 

  • Color:
  • Light pink

 

  • Operating temperature:
  • -60.0 °C - 150.0 °C

 

  • Thermal conductivity:
  • 1.3 W/mK

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                 

                                   

                                     

                                       

                                         

                                           

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