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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Thermal GAP PAD Materials


Reworkable, thermally-conductive gap pad for fragile components

This silicone, thermally-conductive and reworkable gap pad is highly conformable, easily compressable, and is reinforced with a PEN film for rework and improved resistance to puncture and tear.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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When you need a thermally conductive gap pad for fragile components, try BERGQUIST® GAP PAD TGP 1350. This silicone-based pad is highly conformable and compliant, and reinforced with a PEN film. This not only allows rework, but also improves resistance to puncture and tear. It’s highly durable and UL 94 V-0 compliant.

Product category:

Thermal GAP PAD Materials


Carrier type:

PEN film


Light pink

Operating temperature:

-60.0 °C - 150.0 °C

Thermal conductivity:

1.3 W/mK

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