Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials

BERGQUIST GAP PAD TGP 1350

Reworkable, thermally conductive gap pad for fragile components 

This silicone, thermally conductive and reworkable gap pad is highly conformable, easily compressable, and is reinforced with a PEN film for rework and improved resistance to puncture and tear. 

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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Documents

Information

When you need a thermally conductive gap pad for fragile components, try BERGQUIST® GAP PAD TGP 1350. This silicone-based pad is highly conformable and compliant, and reinforced with a PEN film. This not only allows rework, but also improves resistance to puncture and tear. It’s highly durable and UL 94 V-0 compliant. 

Carrier type:

PEN Film

Color:

Light Pink

Operating temperature:

-60.0 °C - 150.0 °C

Thermal conductivity:

1.3 W/mK

Please contact us for ordering options

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