Thermal GAP PAD Materials
Reworkable, thermally conductive gap pad for fragile components
This silicone thermally conductive and reworkable gap pad is highly conformable, easily compressable, and is reinforced with a PEN film for rework and improved resistance to puncture and tear.
Marketing materials
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® GAP PAD TGP 1350 is a silicone-based, thermally conductive gap pad for fragile components. It is highly conformable and compliant, and reinforced with a PEN film. This not only allows rework, but also improves resistance to puncture and tear. It’s highly durable and UL 94 V-0 compliant.
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Easily compressible (shore OO 30)
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Highly durable
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UL94 V-0 compliant
- Product category:
- Thermal GAP PAD Materials
Technologies:
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Thermosets, film
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Thermal management, gap pads
- Carrier type:
- PEN film
- Color:
- Light pink
- Operating temperature:
- -60.0 °C - 150.0 °C
- Thermal conductivity:
- 1.3 W/mK
