Skip to Content
Henkel Adhesive Technologies

Henkel Adhesive Technologies

Loctite Technology Cluster Brand for Product Detail Pages

Thermal GAP PAD Materials

BERGQUIST® GAP PAD® TGP 1350

Reworkable, thermally-conductive gap pad for fragile components

This silicone, thermally-conductive and reworkable gap pad is highly conformable, easily compressable, and is reinforced with a PEN film for rework and improved resistance to puncture and tear.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Please contact us for ordering options

Documents

Information

When you need a thermally conductive gap pad for fragile components, try BERGQUIST® GAP PAD TGP 1350. This silicone-based pad is highly conformable and compliant, and reinforced with a PEN film. This not only allows rework, but also improves resistance to puncture and tear. It’s highly durable and UL 94 V-0 compliant.

Product category:

Thermal GAP PAD Materials

Technologies:

Carrier type:

PEN film

Color:

Light pink

Operating temperature:

-60.0 °C - 150.0 °C

Thermal conductivity:

1.3 W/mK

Related industries and market segments

Please contact us for ordering options

There are some errors, please correct them below.

Recently viewed products

Request a consultation

Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.