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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Thermal GAP PAD Materials

BERGQUIST® GAP PAD TGP 3500ULM

Soft, fiberglass reinforced electrically insulating pad

A thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM).

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH) 2192143
BERGQUIST GAP PAD TGP 3500ULM

Thickness Please make your selection 0.040″

Documents

Information

BERGQUIST® GAP PAD TGP 3500ULM is an extremely soft thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.

Product category:

Thermal GAP PAD Materials

Technologies:

Carrier type:

Fiberglass,Non-fiberglass

Color:

Gray

Flame rating:

V-0

Operating temperature:

-60.0 °C - 200.0 °C

Standard thickness:

0.508 mm - 3.175 mm

Thermal conductivity:

3.5 W/mK

Young's modulus:

27.5 KPa (4.0 psi)

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