Skip to Content
Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials

BERGQUIST® GAP PAD TGP 3500ULM

Soft, fiberglass reinforced electrically insulating pad

A thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM).

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH) 2192143
BERGQUIST GAP PAD TGP 3500ULM

Thickness Please make your selection 0.040″

Documents

Information

BERGQUIST® GAP PAD TGP 3500ULM is an extremely soft thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.

Carrier type:

Fiberglass,Non-fiberglass

Color:

Gray

Flame rating:

V-0

Operating temperature:

-60.0 °C - 200.0 °C

Standard thickness:

0.508 mm - 3.175 mm

Thermal conductivity:

3.5 W/mK

Young's modulus:

27.5 KPa (4.0 psi)

Request a consultation

Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.