Thermal GAP PAD Materials
Soft, fiberglass reinforced electrically insulating pad
A thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM).
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Technical specification
BERGQUIST® GAP PAD TGP 3500ULM is an extremely soft, thermal interface material with a higher natural tack, thereby eliminating the need for additional adhesive layers and provides stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
-60.0 °C - 200.0 °C
0.508 mm - 3.175 mm
27.5 KPa (4.0 psi)