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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials

BERGQUIST® GAP PAD TGP 3500ULM

Soft, fiberglass reinforced electrically insulating pad

A thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM).

Marketing materials

Part no. (SKU/IDH):
2192143

IDH Name:
BERGQUIST GAP PAD TGP 3500ULM

Part no. (SKU/IDH) 2192143
BERGQUIST GAP PAD TGP 3500ULM

Thickness Please make your selection 0.040″

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Information

BERGQUIST® GAP PAD TGP 3500ULM is an extremely soft thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.

  • Product category:
  • Thermal GAP PAD Materials

Technologies:

  • Carrier type:
  • Fiberglass,Non-fiberglass

 

  • Color:
  • Gray

 

  • Flame rating:
  • V-0

 

  • Operating temperature:
  • -60.0 °C - 200.0 °C

 

  • Standard thickness:
  • 0.508 mm - 3.175 mm

 

  • Thermal conductivity:
  • 3.5 W/mK

 

  • Young's modulus:
  • 27.5 KPa (4.0 psi)

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                 

                                   

                                     

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