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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials


Soft, fiberglass reinforced electrically insulating pad

A thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 3.0 W/m-K and ultra low modulus (ULM).

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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BERGQUIST® GAP PAD TGP 3000ULM is an extremely soft thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.



Operating temperature:

-60.0 °C - 200.0 °C

Thermal conductivity:

3.0 W/mK

Please contact us for ordering options

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