Thermal GAP PAD Materials
Soft, fiberglass reinforced electrically insulating pad
A thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 3.0 W/m-K and ultra low modulus (ULM).
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
BERGQUIST® GAP PAD TGP 3000ULM is an extremely soft thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.
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Thermal conductivity: 3.0 W/m-K (ASTM D5470)
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Fiberglass reinforced for puncture, shear, and tear resistance
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High-compliance, low compression stress
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Non-fiberglass option available for additional stress reduction
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Supplied with protective liners for ease of use
Color:
Blue
Operating temperature:
-60.0 °C - 200.0 °C
Thermal conductivity:
3.0 W/mK