Skip to Content
Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials

BERGQUIST® GAP PAD TGP 3000ULM

Soft, fiberglass reinforced electrically insulating pad

A thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 3.0 W/m-K and ultra low modulus (ULM).

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Please contact us for ordering options

Documents

Information

BERGQUIST® GAP PAD TGP 3000ULM is an extremely soft thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.

Color:

Blue

Operating temperature:

-60.0 °C - 200.0 °C

Thermal conductivity:

3.0 W/mK

Please contact us for ordering options

There are some errors, please correct them below.

Request a consultation

Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.