Thermal GAP PAD Materials
Conformable EMI Absorbing Pad
A thermally conductive, silicone-based, conformable gap pad filler providing electromagnetic energy absorption at frequencies of 1GHz and higher.
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- Technical specification
BERGQUIST® GAP PAD® TGP EMI1000 is a highly conformable, combination gap filling material offering both thermal conductivity performance and electromagnetic energy absorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies of 1GHz and higher. The material offers EMI suppression and 1.0 W/m-K thermal conductivity performance with low assembly stress. The soft nature of the material enhances wet-out at the interface resulting in better thermal performance than harder materials with a similar performance rating.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
Dielectric breakdown voltage:
Dielectric constant, @ 1kHz:
Heat capacity, ASTM E1269:
-60.0 °C - 200.0 °C
Shore hardness, Thirty second delay value, ASTM D2240, Bulk Rubber, Shore 00:
0.508 mm - 3.175 mm
1×10 Ohm m