Thermal GAP PAD Materials
High-conformable pad combining thermal dissipation and EMI absorption
This thermally conductive, silicone-based, fiberglass reinforced, highly conformable gap pad filler provides EMI attenuation at frequencies of 1GHz and higher.
Marketing materials
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® GAP PAD® TGP EMI1000 is a highly conformable, fiberglass reinforced, combination gap filling material. It offers both thermal conductivity performance and electromagnetic energy absorption (cavity resonances and/or cross-talk causing electromagnetic interference) at frequencies of 1GHz and higher. You can expect EMI attenuation and 1.0 W/m-K thermal conductivity performance with low assembly stress, and the soft nature of the material enhances wet-out at the interface, resulting in better thermal performance than harder materials with a similar performance rating. It has an inherent natural tack on one side of the material for improved handling and no more thermally-impeding adhesive layers. The other side is tack-free, enhancing handling and rework when you need it. It’s supplied with a protective liner on the material’s tacky side.
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Thermal conductivity: 1.0 W/m-K
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Electromagnetic Interference (EMI) absorbing
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Fiberglass-reinforced for puncture, shear and tear resistance
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Highly conformable, low hardness
- Product category:
- Thermal GAP PAD Materials
Technologies:
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Thermal management, gap pads
- Color:
- Black
- Density:
- 2.4 g/cm³
- Dielectric breakdown voltage:
- 1700.0 Vac
- Dielectric constant, @ 1kHz:
- 6.0
- Flame rating:
- V-0
- Heat capacity, ASTM E1269:
- 1.3 J/g-K
- Operating temperature:
- -60.0 °C - 200.0 °C
- Shore hardness, Thirty second delay value, ASTM D2240, Bulk Rubber, Shore 00:
- 5.0
- Standard thickness:
- 0.508 mm - 3.175 mm
- Thermal conductivity:
- 1.0 W/mK
- Volume resistivity:
- 1×10 Ohm m
