Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials

BERGQUIST GAP PAD TGP EMI1000

Conformable EMI Absorbing Pad

A thermally conductive, silicone-based, conformable gap pad filler providing electromagnetic energy absorption at frequencies of 1GHz and higher.

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Information

BERGQUIST® GAP PAD® TGP EMI1000 is a highly conformable, combination gap filling material offering both thermal conductivity performance and electromagnetic energy absorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies of 1GHz and higher. The material offers EMI suppression and 1.0 W/m-K thermal conductivity performance with low assembly stress. The soft nature of the material enhances wet-out at the interface resulting in better thermal performance than harder materials with a similar performance rating.

For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.

Color:

Black

Density:

2.4 g/cm³

Dielectric breakdown voltage:

1700.0 Vac

Dielectric constant, @ 1kHz:

6.0

Flame rating:

V-0

Heat capacity, ASTM E1269:

1.3 J/g-K

Operating temperature:

-60.0 °C - 200.0 °C

Shore hardness, Thirty second delay value, ASTM D2240, Bulk Rubber, Shore 00:

5.0

Standard thickness:

0.508 mm - 3.175 mm

Thermal conductivity:

1.0 W/mK

Volume resistivity:

1×10 Ohm m

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