Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials


Extremely soft, electrically insulating pad - exceptional thermal conductivity

A high performance, thermally conductive, silicone-based gap pad filler with an exceptional thermal conductivity rating of 12.0 W/m-K and ultra low modulus (ULM).

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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BERGQUIST® GAP PAD TGP 12000ULM is a extremely soft, ultra low modulus (ULM) resin material with a unique filler package that provides excellent thermal performance at low pressures. The flexibility of the material easily conforms to rough or irregular surfaces, allowing exceptional wet-out characteristics at the interface while protective liners on both sides allow for easy application.

For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.

Operating temperature:

-60.0 °C - 200.0 °C

Thermal conductivity:

12.0 W/mK

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