Thermal GAP PAD Materials
Extremely soft, electrically insulating pad with exceptional thermal conductivity
This high performance, thermally conductive, silicone-based gap pad filler has an exceptional thermal conductivity rating of 12.0 W/m-K and ultra low modulus (ULM).
Marketing materials
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® GAP PAD® TGP 12000ULM is an extremely soft, ultra low modulus (ULM) resin material with a unique filler package, which provides excellent thermal performance at low pressures. The flexibility of the material easily conforms to rough or irregular surfaces, allowing exceptional wet-out characteristics at the interface, while protective liners on both sides allow for easy application.
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Thermal conductivity: 12 W/m-K
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Exceptional thermal performance at low pressures
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Ultra-low modulus allows for excellent adhesion to rough surfaces
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Supplied with protective liners for ease of use
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High compliance
- Product category:
- Thermal GAP PAD Materials
Technologies:
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Thermal management, gap pads
- Operating temperature:
- -60.0 °C - 200.0 °C
- Thermal conductivity:
- 12.0 W/mK
