Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials

BERGQUIST® GAP PAD TGP 12000ULM

Extremely soft, electrically insulating pad - exceptional thermal conductivity

A high performance, thermally conductive, silicone-based gap pad filler with an exceptional thermal conductivity rating of 12.0 W/m-K and ultra low modulus (ULM).

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Please contact us for ordering options

Documents

Information

BERGQUIST® GAP PAD TGP 12000ULM is a extremely soft, ultra low modulus (ULM) resin material with a unique filler package that provides excellent thermal performance at low pressures. The flexibility of the material easily conforms to rough or irregular surfaces, allowing exceptional wet-out characteristics at the interface while protective liners on both sides allow for easy application.

For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.

Operating temperature:

-60.0 °C - 200.0 °C

Thermal conductivity:

12.0 W/mK

Please contact us for ordering options

Request a consultation

Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.