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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Thermal GAP PAD Materials

BERGQUIST® GAP PAD TGP 10000ULM

Soft, electrically insulating pad - exceptional thermal conductivity

A high performance, thermally conductive, silicone-based gap pad filler with an exceptional thermal conductivity rating of 10.0W/m-K and ultra low modulus (ULM).

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH) 2591008
BERGQUIST® GAP PAD TGP 10000ULM, 8″x8″ dimension, 0.040″ thickness

Thickness Please make your selection 0.040″

Documents

Information

BERGQUIST® GAP PAD TGP 10000ULM is designed for high performance applications and provides excellent wet-out at the interface characteristics, due to its exceptional conformity to rough or irregular surfaces. The soft gap pad filler material is supplied with a protective liner on both sides for ease of use, and the unique filler package and low modulus design offer high thermal performance at low pressures.

  • Product category:
  • Thermal GAP PAD Materials

Technologies:

  • Color:
  • Gray

 

  • Operating temperature:
  • -60.0 °C - 200.0 °C

 

  • Thermal conductivity:
  • 10.0 W/mK

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                 

                                   

                                     

                                       

                                         

                                           

                                             

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