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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials


Soft, electrically insulating pad - exceptional thermal conductivity

A high performance, thermally conductive, silicone-based gap pad filler with an exceptional thermal conductivity rating of 10.0W/m-K and ultra low modulus (ULM).

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH) 2591008
BERGQUIST® GAP PAD TGP 10000ULM, 8″x8″ dimension, 0.040″ thickness

Thickness Please make your selection 0.040″



BERGQUIST® GAP PAD TGP 10000ULM is designed for high performance applications and provides excellent wet-out at the interface characteristics, due to its exceptional conformity to rough or irregular surfaces. The soft gap pad filler material is supplied with a protective liner on both sides for ease of use, and the unique filler package and low modulus design offer high thermal performance at low pressures.



Operating temperature:

-60.0 °C - 200.0 °C

Thermal conductivity:

10.0 W/mK

Associated industries and market segments

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