Thermal GAP PAD Materials
Soft, electrically insulating pad - exceptional thermal conductivity
A high performance, thermally conductive, silicone-based gap pad filler with an exceptional thermal conductivity rating of 10.0W/m-K and ultra low modulus (ULM).
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Technical specification
BERGQUIST® GAP PAD TGP 10000ULM is designed for high performance applications and provides excellent wet-out at the interface characteristics due to its exceptional conformity to rough or irregular surfaces. The soft gap pad filler material is supplied with a protective liner on both sides for ease of use, and the unique filler package and low modulus design offers high thermal performance at low pressures.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
-60.0 °C - 200.0 °C