Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials

BERGQUIST GAP PAD TGP HC5000

Soft, fibreglass reinforced insulation pad - high performance

Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.

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Documents

Information

BERGQUIST® GAP PAD TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces allowing for exceptional wet-out characteristics at the interface. The material has a natural inherent tack on both sides that reduces the need for additional bulky adhesive layers and comes with protective liners on both side for easy handling.

For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.

Carrier type:

Fiberglass

Flame rating:

V-0

Operating temperature:

-60.0 °C - 200.0 °C

Thermal conductivity:

5.0 W/mK

Young's modulus, ASTM D575:

121.0 KPa (17.5 psi)

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