Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermally conductive adhesives


Thermally conductive epoxy adhesive for heat dissipation components 

This 1-part, low viscosity, thermally conductive epoxy adhesive is specially formulated to bond heat dissipation components, and can be applied using automatic syringe dispensing. 

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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When you need a highly thermally conductive adhesive to bond heat sensitive materials, try LOCTITE® ABLESTIK TE 3530. This high dielectric, low viscosity material has a low temperature cure, and is perfect for use in sensor attach and die attach applications. It can be applied using an automatic syringe dispensing method.  

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