Thermally conductive adhesives
Thermally-conductive epoxy adhesive for heat dissipation components
This 1-part, low viscosity, thermally-conductive epoxy adhesive is specially formulated to bond heat dissipation components, and can be applied using automatic syringe dispensing.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
When you need a highly thermally-conductive adhesive to bond heat sensitive materials, try LOCTITE® ABLESTIK TE 3530. This high dielectric, low-viscosity material has a low temperature cure, and is perfect for use in sensor attach and die attach applications. It can be applied using an automatic syringe dispensing method.
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High thermal conductivity: 2.3 W/m-K
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High dielectric
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High electrical insulation
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1-part: no mixing required