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Sustainable and cost-effective, low pressure molding can reduce PCB protection costs compared to potting, conformal coating and sealing methods.
Henkel TECHNOMELT® and LOCTITE® low pressure molding solutions offer an efficient, low-cost alternative to conventional multi-step, multi-material PCB protection methods. With Henkelʼs simple three-step process, parts are inserted into the moldset, overmolded and then tested. Low pressure molding also eliminates messy two-part material mixing routines, device preparation (masking), long cure times and material waste.
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