LOCTITE^® ABLESTIK CDF 500 is a silver, highly filled, thermally and electrically conductive die-attach adhesive paste for bonding integrated circuits and components to metal substrates. It offers strong adhesion to various wafer metallizations and lead frame finishes and is typically used for QFN, TQFP and eTQFP package applications. It works on various die sizes ranging from 3mm x 3mm to 8mm x 8mm and is ideal when tight control of resin bleed-out is required. LOCTITE ABLESTIK ABP 8303A is based on hybrid chemistry, cures when exposed to heat and provides a consistent bond line thickness.