Part no. (SKU/IDH):
1824350
IDH Name:
LOCTITE® ECCOBOND EN 3838T, 52 g Syringe
Encapsulants
Flexible encapsulant for Pb-free applications
A 1-part, thixotropic coating liquid that provides components on PCBs a flexible, low Tg encapsulation material.
Part no. (SKU/IDH):
1824350
IDH Name:
LOCTITE® ECCOBOND EN 3838T, 52 g Syringe
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} {{/distributor.anyInStock}}In stock {{#distributor.notInStock}} {{/distributor.notInStock}}Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
- Description
- Technical specification
- Question & answer
LOCTITE® ECCOBOND EN 3838T is a black, thixotropic coating liquid for encapsulating components on PCBs. It’s ideal for CSP and BGA package applications, formulated with an epoxy-based resin, and cures fast at moderate temperatures. When cured, it provides physical protection, stable electronic performance, and temperature/humidity/bias testing protection.
-
Low modulus
-
Highly reworkable
-
Fast curing
-
Thixotropic for ease of application
- Product category:
- Encapsulants
Technologies:
-
Electronics assembly materials
- Coefficient of thermal expansion (CTE), Above Tg:
- 217.0 ppm/°C
- Coefficient of thermal expansion (CTE), Below Tg:
- 57.0 ppm/°C
- Cure schedule, @ 130.0 °C:
- 8.0 min
- Cure type:
- Heat cure
- Glass transition temperature (Tg):
- 2.0 °C
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 6700.0 mPa·s (cP)
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} {{/distributor.anyInStock}}In stock {{#distributor.notInStock}} {{/distributor.notInStock}}Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
Every question, request, and challenge is an opportunity for us to help your business perform. And we have all the right people ready to make it happen.
Check our FAQ for quick answers or reach out via phone to our support center. Here, we also offer additional inquiry forms to help you connect with the appropriate Henkel expert.