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Henkel Adhesive Technologies

Henkel Adhesive Technologies


High thermal die attach solutions

Learn about Henkel’s expansive portfolio of high thermal die attach adhesives catered for various package types, die sizes, application reliability criteria, and processing preferences.

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With thermal conductivity ranging from 20 W/m-K to 165 W/m-K and in formulations that span traditional pastes to pressure-less and pressure-assisted sintering, Henkel high thermal die attach materials deliver proven performance supported by global R&D resources and a team of semiconductor packaging experts.

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