Brochure
Learn about Henkel’s expansive portfolio of high thermal die attach adhesives catered for various package types, die sizes, application reliability criteria, and processing preferences.
With thermal conductivity ranging from 20 W/m-K to 165 W/m-K and in formulations that span traditional pastes to pressure-less and pressure-assisted sintering, Henkel high thermal die attach materials deliver proven performance supported by global R&D resources and a team of semiconductor packaging experts.
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Every question, request, and challenge is an opportunity for us to help your business perform. And we have all the right people ready to make it happen.
Check our FAQ for quick answers or reach out via phone to our support center. Here, we also offer additional inquiry forms to help you connect with the appropriate Henkel expert.