Part no. (SKU/IDH):
373041
IDH Name:
LOCTITE® 3568, 10 ml Syringe
Fill encapsulants
Reworkable liquid underfill for flip-chip, CSP, BGA and µBGA assemblies
This 1-part, epoxy-based liquid underfill provides processing and reliability similar to conventional thermoset underfills but, unlike these, is reworkable.
Part no. (SKU/IDH):
373041
IDH Name:
LOCTITE® 3568, 10 ml Syringe
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® 3568 is an epoxy-based liquid underfill compatible with polyimide and silicon nitride passivated flip-chip, CSP, BGA and µBGA assemblies. It cures in 5 to 15 minutes when exposed to temperatures of 150°C to 165°C (302°F to 329°F), is easy to dispense, and quickly penetrates gaps as small as 0.025 mm (0.001”). It's designed to provide processing and reliability similar to conventional thermoset underfills but with the added advantage of reworkability: when heated to high temperatures for short periods of time (typically 210°C/410°F to 220°C/428°F for 1 minute) the cured epoxy matrix undergoes physical and chemical transformations, allowing removal of the component when torque is applied.
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1-part: no mixing required
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Heat cures in 5-15 minutes
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Easy to dispense
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Penetrates gaps as small as 0.025 mm (0.001”)
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Reworkable
- Product category:
- Fill encapsulants
Technologies:
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Thermosets, electronics assembly materials
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Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
