Thermal GAP PAD Materials
Soft, electrically insulating pad - cost-effective
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.5W/mK.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® GAP PAD TGP 1500 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness, and is conformable and electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with ease of handling.
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Unreinforced construction for additional compliancy
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Thermal conductivity: 1.5 W/m-K
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UL94 V-0 compliant
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Reworkable
Product category:
Thermal GAP PAD Materials
Technologies:
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Thermal management, silicone pads
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Thermal management, gap pads
Color:
Black
Operating temperature:
-60.0 °C - 200.0 °C
Standard thickness:
0.508 mm - 5.08 mm
Thermal conductivity:
1.5 W/mK
Young's modulus, ASTM D575:
310.0 KPa (45.0 psi)
