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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials


Soft, electrically insulating pad - cost-effective

Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.5W/mK.

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BERGQUIST® GAP PAD TGP 1500 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness, and is conformable and electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with ease of handling.



Operating temperature:

-60.0 °C - 200.0 °C

Standard thickness:

0.508 mm - 5.08 mm

Thermal conductivity:

1.5 W/mK

Young's modulus, ASTM D575:

310.0 KPa (45.0 psi)

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