Thermal GAP PAD Materials
Soft, electrically insulating pad - cost-effective
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.5W/mK.
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- Technical specification
BERGQUIST® GAP PAD TGP 1500 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
-60.0 °C - 200.0 °C
0.508 mm - 5.08 mm
Young's modulus, ASTM D575:
310.0 KPa (45.0 psi)