Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials

BERGQUIST GAP PAD TGP 1500

Soft, electrically insulating pad - cost-effective

Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.5W/mK.

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Documents

Information

BERGQUIST® GAP PAD TGP 1500 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.

Color:

Black

Operating temperature:

-60.0 °C - 200.0 °C

Standard thickness:

0.508 mm - 5.08 mm

Thermal conductivity:

1.5 W/mK

Young's modulus, ASTM D575:

310.0 KPa (45.0 psi)

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