Thermal GAP PAD Materials
Thermally conductive, reinforced gap filler for low-stress applications
This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
The highly conformable nature of BERGQUIST® GAP PAD TGP 2000 means the pad can fill air voids and air gaps with stepped topography, rough surfaces, and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application assembly. It’s supplied with protective liners on both sides, and the top side has reduced tack for ease of handling.
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Thermal Conductivity: 2.0 W/m-K
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Low "S-Class" thermal resistance at very low pressures
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Designed for low-stress applications
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Highly conformable
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Low hardness
- Product category:
- Thermal GAP PAD Materials
Technologies:
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Thermal management, silicone pads
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Thermal management, gap pads
- Color:
- Gray
- Density:
- 2.9 g/cm³
- Dielectric breakdown voltage:
- 5000.0 Vac
- Dielectric constant, @ 1kHz:
- 6.0
- Flame rating:
- V-0
- Heat capacity, ASTM E1269:
- 0.6 J/g-K
- Operating temperature:
- -60.0 °C - 200.0 °C
- Shore hardness, Thirty second delay value, ASTM D2240, Bulk Rubber, Shore 00:
- 30.0
- Standard thickness:
- 0.508 mm - 3.175 mm
- Thermal conductivity:
- 2.0 W/mK
- Volume resistivity:
- 1×10 Ohm m
