Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials

BERGQUIST GAP PAD TGP 2000

Thermally conductive, reinforced gap filling material for low-stress applications 

This silicone based, highly conformable, reinforced ‘S-Class’ gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material. 

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Please contact us for ordering options

Documents

Information

The highly conformable nature of BERGQUIST® GAP PAD TGP 2000 means the pad can fill in air voids and air gaps with stepped topography, rough surfaces and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application assembly. It’s supplied with protective liners on both sides, and the top side has reduced tack for ease of handling. 

Color:

Gray

Density:

2.9 g/cm³

Dielectric breakdown voltage:

5000.0 Vac

Dielectric constant, @ 1kHz:

6.0

Flame rating:

V-0

Heat capacity, ASTM E1269:

0.6 J/g-K

Operating temperature:

-60.0 °C - 200.0 °C

Shore hardness, Thirty second delay value, ASTM D2240, Bulk Rubber, Shore 00:

30.0

Standard thickness:

0.508 mm - 3.175 mm

Thermal conductivity:

2.0 W/mK

Volume resistivity:

1×10 Ohm m

Please contact us for ordering options

Request a consultation

Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.