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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials

BERGQUIST® GAP PAD® TGP 5000

Soft, fiberglass reinforced insulation pad - high performance

Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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Information

BERGQUIST® GAP PAD TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance. Due to the highly flexible and elastic nature of the material, it easily conforms to unique contours while maintaining structural integrity and without applying stress to fragile components. Reinforced with fiberglass to protect against punctures, and improved shear and tear resistance and with natural tack on both sides, this product is easy to handle and is ideal for high performance applications at low mounting pressures. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.

Color:

Light green

Density:

3.6 g/cm³

Dielectric breakdown voltage:

5000.0 Vac

Dielectric constant, @ 1kHz:

7.5

Flame rating:

V-0

Heat capacity, ASTM E1269:

1.0 J/g-K

Operating temperature:

-60.0 °C - 200.0 °C

Shore hardness, Thirty second delay value, ASTM D2240, Bulk Rubber, Shore 00:

35.0

Standard thickness:

0.508 mm - 3.175 mm

Thermal conductivity:

5.0 W/mK

Volume resistivity:

1×10 Ohm m

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