Thermal GAP PAD Materials
Ultra soft, fibreglass-reinforced insulation pad - high voltage applications
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 1.0 W/m-K and ultra conformable behavior.
Marketing materials
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® GAP PAD® TGP 1000VOUS is a pre-cured and electrically insulating material with a gel-like modulus that provides shock absorbing and low stress vibration-dampening characteristics. This product is recommended for applications that require isolation between heat sinks and high voltage, bare-leaded devices. Ideal for filling air gaps in high voltage devices.
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Highly conformable, low hardness
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Thermal conductivity: 1.0 W/m-K
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High dielectric strength
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Decreased strain
- Product category:
- Thermal GAP PAD Materials
Technologies:
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Thermal management, circuits and substrates
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Thermal management, sil pads
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Specialties, others
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Thermal management, silicone pads
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Specialties, equipment
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Thermal management, gap pads
- Carrier type:
- Fiberglass
- Color:
- Pink
- Operating temperature:
- -60.0 °C - 200.0 °C
- Standard thickness:
- 0.508 mm - 6.35 mm
- Thermal conductivity:
- 1.0 W/mK
- Young's modulus, ASTM D575:
- 55.0 KPa (8.0 psi)
