Thermal GAP PAD Materials
Ultra soft, fibreglass reinforced insulation pad - high voltage applications
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.0 W/m-K and ultra conformable behaviour.
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- Technical specification
BERGQUIST® GAP PAD TGP 1000VOUS is a pre-cured and electrically insulating material with a “gel-like” modulus that provides shock absorbing and low stress vibration dampening characteristics. This product is recommended for applications that require isolation between heat sinks and high-voltage, bare-leaded devices. Ideal for filling air gaps in high voltage devices.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
-60.0 °C - 200.0 °C
0.508 mm - 6.35 mm
Young's modulus, ASTM D575:
55.0 KPa (8.0 psi)