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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials


Ultra soft, fibreglass reinforced insulation pad - high voltage applications

Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.0 W/m-K and ultra conformable behavior.

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BERGQUIST® GAP PAD TGP 1000VOUS is a pre-cured and electrically insulating material with a gel-like modulus that provides shock absorbing and low stress vibration-dampening characteristics. This product is recommended for applications that require isolation between heat sinks and high-voltage, bare-leaded devices. Ideal for filling air gaps in high voltage devices.

Carrier type:




Operating temperature:

-60.0 °C - 200.0 °C

Standard thickness:

0.508 mm - 6.35 mm

Thermal conductivity:

1.0 W/mK

Young's modulus, ASTM D575:

55.0 KPa (8.0 psi)

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