Part no. (SKU/IDH):
3001737
IDH Name:
BERGQUIST® GAP FILLER TGF 2100LVO, 2 each 5 gallon pails Hobbock/Pail
Thermal gap fillers
Next generation gap filler for electronic assembly applications
This next generation, 2-part, low volatile outgassing (LVO) silicone-based gap filler is designed for control units and ADAS data module and other components, and offers highly reliable thermal management and robust processing.
Part no. (SKU/IDH):
3001737
IDH Name:
BERGQUIST® GAP FILLER TGF 2100LVO, 2 each 5 gallon pails Hobbock/Pail
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} In stock {{#distributor.notInStock}} Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly. You will receive an email notification when product is back in stock.You will not receive an email notification when product is back in stock.
{{/distributor.isExpanded}}
{{^distributor.isExpanded}}
{{/distributor.isExpanded}}
{{/distributor.isVisible}}
{{/data}}
- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® GAP FILLER TGF 2100LVO is a 2-part, low-volatile silicone, room temperature curable gap filler suitable for use in a wide range of electronic assembly applications. With a minimum of 2.2 W/(m.K) thermal conductivity and excellent wet-out property, this versatile solution is the best choice to optimize heat dissipation in a wide range of electronics applications.
-
Thermal conductivity: >2.2 W/(m∙K)
-
Outstanding dispensing flow behavior
-
High temperature stability
-
Low volatility
-
No D4-D10 compounds
-
REACH compliant
- Product category:
- Thermal gap fillers
Technologies:
-
Thermal management, standard viscosity liquids
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} In stock {{#distributor.notInStock}} Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly. You will receive an email notification when product is back in stock.You will not receive an email notification when product is back in stock.
{{/distributor.isExpanded}}
{{^distributor.isExpanded}}
{{/distributor.isExpanded}}
{{/distributor.isVisible}}
{{/data}}