Part no. (SKU/IDH):
2191218
IDH Name:
BERGQUIST® GAP FILLER TGF 3600
Thermal gap fillers
Versatile, high-performance dispensable liquid
This highly thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It has excellent low- and high-temperature, mechanical and chemical stability.
Marketing materials
Part no. (SKU/IDH):
2191218
IDH Name:
BERGQUIST® GAP FILLER TGF 3600
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
- Question & answer
BERGQUIST® GAP FILLER TGF 3600 is a 3.6 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). It exhibits ultra-high thermal performance and superior softness. This product has low modulus to help relieve coefficient of thermal expansion (CTE) stresses in thermal cycling and provide excellent vertical gap stability. It can be used for fragile and low stress applications in various fields. This product is curable at room temperature. However, the cure rate can be accelerated with the application of heat.
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Thermal conductivity: 3.6 W/m-K
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Ultra low modulus
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Ultra-conforming
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Easily dispensable
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For information on our thermal management materials' UL certifications, please refer to UL file E59150
- Product category:
- Thermal gap fillers
Technologies:
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Standard viscosity liquids
- Cure type:
- Heat cure
- Flame rating:
- V-0
- Hardener: Color:
- Blue
- Mixed: Color:
- Blue
- Operating temperature:
- -60.0 °C - 200.0 °C
- Resin: Color:
- White
- Thermal conductivity:
- 3.6 W/mK
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Large volume or special order?
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