Part no. (SKU/IDH):
3164526
IDH Name:
LOCTITE® BERGQUIST® TGP 30000SF, 0.020″ thickness
Thermal GAP PAD Materials
Highly thermally conductive, silicone-free gap pad
This highly conformable gap pad is silicone-free, has exceptional thermal performance, and is ideal for high-performance computing applications.
Part no. (SKU/IDH):
3164526
IDH Name:
LOCTITE® BERGQUIST® TGP 30000SF, 0.020″ thickness
Thickness Please make your selection 0.020″
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
- Question & answer
LOCTITE® BERGQUIST TGP 30000SF is a gap-filling material with a thermal conductivity of 30 W/m-K. It is specially formulated for high-performance applications requiring silicone free solutions, and offers exceptional thermal performance. It has a one-sided tack layer for ease of handling and assembly. Ideal for AI and cloud-computing datacenters, DSPs and lasers in optical transceivers, GPUs and CPUs in high-performance computing, immersion cooling for AI accelerators, telecom infrastructure, vehicle control units and sensors for ADAS, and aerospace / defence electronics.
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Silicone free
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Operating temperature: -40°C to 125°C (104°F to 257°F)
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High thermal conductivity: 30 W/m-K
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Low bleed, low outgassing
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One-sided tack layer for ease of handling and assembly
- Product category:
- Thermal GAP PAD Materials
Technologies:
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Gap pads
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Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
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