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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Die attach adhesives


Medium to large die attach electrically non-conductive adhesive

This electrically-insulating die attach adhesive is formulated with a medium modulus using hybrid chemistry, and is targeted for use on medium to large die sizes.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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For high MRT performance, high thermal conductivity, and high reliability, choose LOCTITE® ABLESTIK ABP 8910T. This heat cure, electrically non-conductive adhesive is ideal for use on medium to large die sizes, and is perfect for copper, silver, PPF and alloy 42 substrates.

Product category:

Electrically non-conductive die attach pastes



Die attach

Coefficient of thermal expansion (CTE):

28.0 ppm/°C

Cure type:

Heat cure

Viscosity, Brookfield CP51, @ 25.0 °C:

13000.0 mPa·s (cP)

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