Henkel Adhesive Technologies

Henkel Adhesive Technologies

Die attach adhesives

LOCTITE® ABLESTIK ABP 8910T

Medium to large die attach, electrically non-conductive adhesive 

This electrically insulating die attach adhesive is formulated with a medium modulus using hybrid chemistry, and is targeted for use on medium to large die sizes. 

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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Information

For high MRT performance, high thermal conductivity, and high reliability, choose LOCTITE® ABLESTIK ABP 8910T. This heat cure, electrically non-conductive adhesive is ideal for use on medium to large die sizes, and is perfect for copper, silver, PPF and alloy 42 substrates.  

Applications:

Die Attach

Coefficient of thermal expansion (CTE):

28.0 ppm/°C

Cure type:

Heat Cure

Viscosity, Brookfield CP51, @ 25.0 °C:

13000.0 mPa·s (cP)

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