Henkel Adhesive Technologies

Henkel Adhesive Technologies

Electrically non-conductive adhesives


Electrically non-conductive adhesive and sealant for heat sensitive devices

This 1-part electrically non-conductive adhesive has been specially formulated for use in heat sensitive devices. It has a fast cure at a low cure temperature. 

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When you’re working with heat sensitive devices and need an electrically non-conductive adhesive and sealant, LOCTITE® 3220 is a great choice. This 1-part adhesive cures in 5-10 minutes at 176°F, has excellent adhesion, and is ideal for applications including image sensors and markerless motion capture (MMC). 

Casson viscosity, cone & plate Haake PK100, M10/PK1, 2°, @ 25.0 °C:

2500.0 mPa·s (cP)

Cure schedule, @ 80.0 °C:

5.0 min. - 10.0 min.

Cure type:

Heat Cure

Number of components:

1 Part

Shear strength:

2960.0 psi

Storage temperature:

-15.0 °C

Thixotropic index:


Viscosity, Brookfield CP51, @ 25.0 °C:

7150.0 mPa·s (cP)

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